Smart phone fingerprint module set whole-version test system
A fingerprint module and smart phone technology, applied in the direction of measuring devices, measuring electrical variables, and measuring device casings, can solve problems such as inability to contact with detection probes, inaccurate detection results, and low work efficiency to achieve PIN protection Needle, simple and convenient operation, and the effect of improving production efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] Embodiment 1: A smart phone fingerprint module full-page testing system, including a base 1, a core board 2, a substrate 3, a PCB board 4, a support board 5, a carrier board 6, a manual pressing mechanism 30 and a data display mechanism 7, The PCB board 4 is installed on the upper surface of the substrate 3, the support plate 5 is installed on the upper surface of the PCB board 4, the carrier board 6 is located directly above the support board 5, and the core board 2 is connected to the PCB board through a DuPont line 8. 4 connections;
[0028] The PCB board 4 is provided with several springs 9, and the support plate 5 is provided with a spring hole 10 for the spring 9 to penetrate and a plurality of installation through holes 11, and the spring 9 arranged on the upper surface of the PCB board 4 passes through the support board The spring hole 10 on the 5 is in contact with the lower surface of the carrier board 6, and a PIN needle seat 12 with a PIN needle 13 is embedd...
Embodiment 2
[0033]Embodiment 2: A smart phone fingerprint module full-page testing system, including a base 1, a core board 2, a substrate 3, a PCB board 4, a support board 5, a carrier board 6, a manual pressing mechanism 30 and a data display mechanism 7, The PCB board 4 is installed on the upper surface of the substrate 3, the support plate 5 is installed on the upper surface of the PCB board 4, the carrier board 6 is located directly above the support board 5, and the core board 2 is connected to the PCB board through a DuPont line 8. 4 connections;
[0034] The PCB board 4 is provided with several springs 9, and the support plate 5 is provided with a spring hole 10 for the spring 9 to penetrate and a plurality of installation through holes 11, and the spring 9 arranged on the upper surface of the PCB board 4 passes through the support board The spring hole 10 on the 5 is in contact with the lower surface of the carrier board 6, and a PIN needle seat 12 with a PIN needle 13 is embedde...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


