Preparation method of surface of anti-drag copper
A technology of copper surface and pure copper, which is applied in the field of preparation of drag-reducing copper surface, can solve problems such as the difficulty of producing drag-reducing copper surface, and achieve the effect of improving service life and reducing frictional resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0035] The invention provides a method for preparing a drag-reducing copper surface, which comprises the following steps:
[0036] 1) Pretreating pure copper or a copper-containing alloy to form a substrate 1. The copper content in the pure copper is more than 99.9%, and the copper content in the copper-containing alloy is more than 80%;
[0037] 2) Copper plating on the first substrate, specifically: the first substrate is immersed in an electroless plating solution containing copper elements for chemical deposition, and after the reaction is completed, the second substrate is formed;
[0038] 3) Nickel plating on the substrate 2, specifically: the prepared substrate 2 is used as the cathode, and the pure nickel plate is used as the anode, immersed in the electroplating solution for electrochemical deposition, and after the reaction is completed, nanometer-sized papillae are formed. Level villi crystal structure, which forms the base three;
[0039] 4) Modification, immersin...
specific Embodiment 1
[0046] 1) Metallographic grinding of pure copper or copper-containing alloys with silicon carbide sandpaper of 200 mesh to 2000 mesh, and ultrasonic cleaning in acetone;
[0047] 2) Use 50g / LNa again 3 PO 4 12H 2 O, 50g / L NaOH and 5g / L NaOH 2 SiO 3 The mixed solution is washed with alkali at room temperature for one minute to remove the oxide content of pure copper or copper-containing alloys, such as grease,
[0048] 3) pickling again with 10% H2SO4 solution, the pickling time is 10s, and drying in cold air to obtain the above-mentioned substrate 1; the substrate 1 is the substrate copper sheet, and its size is: 25mm×25mm×0.3mm;
[0049] 4) Activate with 0.001mol / L palladium chloride solution for 1min;
[0050] 5) Plating copper on the above-mentioned substrate copper sheet, specifically: immersing substrate 1 in an electroless plating solution containing copper elements for chemical deposition, after the reaction is completed, forming substrate 2 with a micron-scale pap...
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More