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Multi-nozzle device

A technology with multiple nozzles and nozzles, applied in the direction of spraying devices, spraying devices, etc., can solve the problems of poor efficiency, poor cleaning effect, slow speed, etc., and achieve the effect of improving cleaning speed

Active Publication Date: 2019-11-26
ELS SYST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing cleaning process, the wafer is usually cleaned by a single nozzle, so the slow cleaning speed leads to poor efficiency and poor cleaning effect

Method used

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Embodiment Construction

[0039] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0040] refer to figure 1 , is the first embodiment of the multi-nozzle device of the present invention. The multi-nozzle device 200 is mainly used in the process of semiconductor wafers to clean a substrate 1 such as a wafer. The multi-nozzle device 200 includes a combination assembly 2 and at least two nozzles 3, 3'.

[0041] refer to figure 1 and figure 2 , the combination assembly 2 includes a combination vertical plate 21, the combination vertical plate 21 is parallel to a vertical direction Z, and the combination vertical plate 21 includes a plurality of joint points arranged at intervals, and the joint points are in total along the vertical direction Z. flat. Each spray head 3, 3' can be selectively combined with two of the joint points, and each spray head 3, 3' can be detachably combined with the two joint points. Specifically, each spray ...

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PUM

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Abstract

A multi-nozzle apparatus includes a bonding assembly and at least two nozzles. The bonding assembly includes a bonding vertical plate that is parallel to a vertical direction. The bonding riser includes a plurality of bonding points spaced apart from each other. The bonding points are coplanar along the vertical direction, the nozzles are selectively bonded to two of the bonding points, and the nozzles are detachably bonded to the two bonding points so that the nozzles can be fixed to the bonding vertical plate and located at a desired spraying angle position.

Description

technical field [0001] The present invention relates to a multi-nozzle device, in particular to a multi-nozzle device for cleaning substrates such as semiconductor wafers. Background technique [0002] Semiconductor wafers will go through many different processes during the manufacturing process. After the wafers are processed by each process, there will be residues such as chemical agents on the surface of the wafers. Therefore, it is necessary to spray the nozzles on the wafer during the cleaning process Spray the cleaning solution round to remove residue on the wafer. [0003] However, in the existing cleaning process, the wafer is usually cleaned by a single nozzle, therefore, the slow cleaning speed leads to poor efficiency and poor cleaning effect. Contents of the invention [0004] The main purpose of the present invention is to provide a multi-spray head device, through the design of the combination assembly, the required number of spray heads can be selectively a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B1/14
CPCB05B1/14
Inventor 邓志明
Owner ELS SYST TECH