Material source arrangement and nozzle for vacuum deposition
A technology of vacuum deposition and deposition of materials, applied in vacuum evaporation plating, metal material coating process, coating and other directions, can solve problems such as expensive, time-consuming, and complicated OLED manufacturing process
Inactive Publication Date: 2017-09-26
APPLIED MATERIALS INC
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Problems solved by technology
[0004] The different sized substrates and the different materials to be deposited together with the evaporated material further complicate, time-consuming and thus more expensive the manufacturing process of OLEDs
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[0018] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals designate the same parts. In general, only the differences with respect to individual implementations are described. Each example is provided by way of illustration and not meant to be a limitation of further or other embodiments. Additionally, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield still further embodiments. It is intended that the description include such modifications and variations.
[0019] Additionally, in the following description, a material source may be understood as a source providing a material to be deposited on a substrate. In particular, the material source may be configured to provide material to be deposited on a substrate in a vacuu...
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Abstract
A material source arrangement (100) for depositing a material on a substrate (121) in a vacuum deposition chamber (110) is described. The material source arrangement includes a distribution pipe (106) being configured to be in fluid communication with a material source (102) providing the material to the distribution pipe (106); and at least one nozzle (200; 712) configured for guiding the material provided in the distribution pipe (106) to the vacuum deposition chamber (110). The nozzle (200; 712) includes a thread for repeatedly connecting and disconnecting the nozzle to the distribution pipe. Further, a deposition apparatus for depositing material on a substrate (121) including the material source arrangement, the nozzle for the material source arrangement, and a method for providing the distribution pipe (106) and the nozzle (200; 712) for the material source arrangement (100) are described.
Description
technical field [0001] Embodiments of the invention relate to a material source arrangement, a deposition device with a material source arrangement, a nozzle for a material source arrangement and a method for providing a material source arrangement with a distribution pipe. Embodiments of the invention relate in particular to a material source arrangement for a vacuum deposition chamber, a vacuum deposition apparatus with a material source arrangement, a nozzle for a material source arrangement for a vacuum deposition chamber, and a method for providing a material source arrangement in a vacuum deposition chamber. The material source arrangement in provides a method of dispensing pipes, specifically relating to a material source, a deposition device, a nozzle and a method for an evaporation process. Background technique [0002] An organic evaporator is a production tool for organic light-emitting diodes (OLEDs). OLEDs are a special type of light-emitting diode in which the...
Claims
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IPC IPC(8): C23C14/12C23C14/56C23C16/455C23C14/24
CPCC23C14/12C23C14/562C23C16/45578C23C14/24C23C14/243H10K71/164
Inventor 斯蒂芬·班格特乌韦·许斯勒乔斯·曼纽尔·迭格斯-坎波
Owner APPLIED MATERIALS INC