Secondary utilization method of dicing knife

Abstract

The invention relates to a reutilization method of a dicing blade. The dicing blade comprises a blade body and a blade hub used for fixing the blade body. The portion, exposed out of the blade hub, of the blade body serves as a cutting edge. The length of the portion, stretching out of the blade hub, of the cutting edge is smaller than a specified value. The reutilization method of the dicing blade comprises the following steps that (1) the blade hub is polished, most materials on the portion, close to the cutting edge, of the blade hub are removed through polishing, and a small part of materials are reserved so that the cutting edge can be prevented from being damaged; (2) the cutting edge is polished, specifically, the cutting edge is completely removed through polishing; (3) the blade hub is corroded, the materials reserved on the blade hub in the step (1) are completely removed through corrosion, the blade body is exposed so that a new cutting edge can be formed, and the stretching-out length of the new cutting edge is made to meet the specified value; (4) the blade body is subjected to burnishing, specifically, burnishing treatment is conducted on the cutting edge; and (5) the blade body is cleaned. According to the reutilization method of the dicing blade, through a series of treatment on the dicing blade, the stretching-out length of the cutting edge of the dicing blade is made to meet the specified value, the allowable lowest machining requirement is met, thus, the dicing blade can be reutilized, and the production cost is reduced.

Description

technical field [0001] The invention relates to wafer cutting in semiconductor packaging technology, in particular to a method for secondary utilization of a dicing knife. Background technique [0002] A dicing machine is a device used on a semiconductor integrated circuit packaging line to cut a wafer into independent circuit units. The dicing knife is a special blade for the dicing machine. [0003] When the wafer is diced, it is subjected to the pressure and friction of the wafer, causing the blade of the dicing knife to wear inward, so that the radius of the dicing knife (that is, the extension of the blade) gradually decreases. Regardless of whether it is an unused scribing knife or a used scribing knife, when the blade extension of the scribing knife is not enough to meet the minimum requirements for allowable processing, it cannot be used for production. [0004] In the case of insufficient extension of the scribing knife blade, the old scribing knife is generally s...

AI Technical Summary

Problems solved by technology

However, since wafer dicing knives can generally only be purchased abroad, the cost is relatively high. If the old scribing knives are not protruding enough to be scrapped directly, resources will be wasted and production costs will be increased.

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