SIP packaging structure with integrated vertical photoelectric transceiver function and its process method

Abstract

The invention relates to a vertical type SiP package structure integrated with photoelectric receiving and sending functions and a technique method of the SiP encapsulation structure. The structure comprises a substrate (1). A light sender (2) and a light receiver (3) are arranged on the substrate (1) in a surface-mount manner. A metal housing (4) is arranged on each of the light sender (2) and the light receiver (3). Each metal housing (4) comprises a peripheral housing body (4.1). A circular through hole (4.2) is arranged in the center of each peripheral housing body (4.1) in the vertical direction. A lens (5) is arranged in the middle part of each circular through hole (4.2). A chip (6) and a passive device (7) are arranged on the substrate outside the metal housings (4) in a surface-mount manner. Plastic materials (9) are exposed to the upper ends of the circular through holes (4.2) of the metal housings (4) so that light openings (10) are formed. According to the invention, by use of the metal housing parts, a photoelectric sending module and a photoelectric receiving module are integrated in one SiP package, so tedious processes of the current products are simplified; production efficiency is improved; and anti-external force ability and the sealing performance of the products are improved.

Description

technical field [0001] The invention relates to a SiP package structure with integrated vertical photoelectric transceiver function and a process method thereof, belonging to the technical field of semiconductor package. Background technique [0002] Optical fiber technology has become more and more popular, and photoelectric modules have been widely used. The current optoelectronic module is mainly assembled by receiving optical sub-assembly, transmitting optical sub-assembly, optical interface, internal circuit board, heat conducting frame and shell (see figure 1 ). Among them, the sending optical subassembly is to assemble the optical sending device on the sending side PCB. The optical sending device is generally composed of a laser (laser diode), a backlight tube (backlight detection tube), a thermistor, a TEC cooler, and an optical alignment mechanism. The components are integrated inside a metal shell; the receiving optical subassembly is to assemble the light receiv...

AI Technical Summary

Problems solved by technology

To complete a complete photoelectric transceiver module structure, it needs to be assembled one by one. The whole process has many procedures and the production efficiency is relatively low, and the anti-external force ability of the assembled photoelectric transceiver module structure is relatively poor. The assembled photoelectric transceiver module structure The airtightness is not good enough, and it is easy to be corroded by water vapor.

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