Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method

A technology of grinding and protecting tape, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc. It can solve the problems that the gap cannot pass through the sensor, the sensor cannot be identified, and the gap cannot be detected to achieve heat resistance. Excellent, improved workability, and improved efficiency

Active Publication Date: 2017-12-01
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology describes an improvement on how well a protective film called Silicone rubber covers certain areas inside a device's chip before it goes through various steps like polishing or cleanup processes that may damage them. By doing this, manufacturers are able to improve their productivity while maintaining good quality control over these damaged regions.

Problems solved by technology

This technical problem addressed in these prior arts relates to improving visual inspection quality when attaching a temporary support called a cover glass onto a semiconduum wafer without causing damage thereto. Additionally, reducing defectivity caused by residual tonings after cleaning the workpiece's surface requires controlling the amount of force applied while maintaining accuracy in the attachment of the temporary support.

Method used

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  • Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method
  • Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method
  • Surface protection adhesive tape for semiconductor wafer backgrinding, and semiconductor wafer grinding method

Examples

Experimental program
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Effect test

Embodiment 1

[0123] In 100 parts by mass of ethylene-vinyl acetate copolymer (EVA) resin A containing 6.0% by mass of the vinyl acetate component, 0.6 parts by mass of copper phthalocyanine blue containing the blue pigment 5.0% by mass and vinyl acetate were dry blended The content of the ester component is 6.0% by mass of ethylene-vinyl acetate copolymer (EVA) resin B. The extrusion molding was performed by an extrusion molding machine, thereby obtaining a base film A having a thickness of 165 μm and a back surface roughness Rz=1.2 μm.

[0124] Mixing in proportions of 2 mol% of methacrylic acid, 50 mol% of 2-ethylhexyl acrylate, 30 mol% of 2-hydroxyethyl acrylate, and 18 mol% of methyl acrylate, adding 0.2 mass per 100 mass parts of total monomers Parts of azobisisobutyronitrile were copolymerized in an ethyl acetate solution at a temperature of 70°C in a reaction vessel replaced with nitrogen, thereby obtaining a polymer solution with a weight average molecular weight of 800,000. In this ...

Embodiment 2

[0127] In 100 parts by mass of ethylene-vinyl acetate copolymer (EVA) resin A containing 6.0% by mass of the vinyl acetate component, 0.3 parts by mass of copper phthalocyanine blue containing the blue pigment 5.0% by mass and vinyl acetate were dry blended The content of the ester component is 6.0% by mass of ethylene-vinyl acetate copolymer (EVA) resin B. Extrusion molding was performed by an extrusion molding machine, thereby obtaining a base film B having a thickness of 165 μm and a surface roughness of the back surface Rz=0.7 μm.

[0128] Mixing is carried out in a proportion of 1 mol% of methacrylic acid, 22 mol% of 2-hydroxyethyl acrylate, and 77 mol% of butyl acrylate, and 0.3 parts by mass of azobisisobutyronitrile is added to 100 parts by mass of the total monomers. In the reaction vessel replaced with nitrogen, copolymerization was carried out in an ethyl acetate solution at a temperature of 70°C to obtain a polymer solution with a weight average molecular weight of 30...

Embodiment 3

[0131] In 100 parts by mass of ethylene-vinyl acetate copolymer (EVA) resin C having a vinyl acetate content of 10.0% by mass, 0.6 parts by mass of copper phthalocyanine blue containing the blue pigment 5.0% by mass and vinyl acetate were dry blended The content of the ester component is 6.0% by mass of ethylene-vinyl acetate copolymer (EVA) resin B. The extrusion molding was performed by an extrusion molding machine, thereby obtaining a base film C having a thickness of 100 μm and a surface roughness Rz of the back surface Rz=3.7 μm.

[0132] Mixing is carried out in a proportion of 2 mol% methacrylic acid, 29 mol% 2-hydroxyethyl acrylate, and 69 mol% 2-ethylhexyl acrylate, and 0.2 parts by mass of azobisiso is added relative to 100 parts by mass of the total monomers. Nitrile was copolymerized in an ethyl acetate solution in a reaction vessel replaced with nitrogen at a temperature of 70°C to obtain a polymer solution with a weight average molecular weight of 230,000. In this ...

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Abstract

Provided are: a surface protection adhesive tape for semiconductor wafer backgrinding, said tape being composed of a substrate and an adhesive layer that is provided on one surface of the substrate, wherein the surface roughness of the substrate surface on which the adhesive layer is not formed is Rz = 0.7-5.0 [mu]m, the total light transmittance of the surface protection adhesive tape for semiconductor wafer backgrinding at a wavelength of 500-600 nm is 40-80%, the difference between the color difference ([delta]EM) of a mirror wafer and the color difference ([delta]ET) when the surface protection adhesive tape for semiconductor wafer backgrinding is bonded to the mirror wafer is [delta]ET-[delta]EM > 6.5, and the surface protection adhesive tape for semiconductor wafer backgrinding is bonded to the surface of a semiconductor wafer having a notch; and a semiconductor wafer grinding method using said adhesive tape.

Description

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Claims

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Application Information

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Owner FURUKAWA ELECTRIC CO LTD
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