A kind of process method for preparing nano-silver solder paste based on inverse microemulsion system

A technology of inverse microemulsion and process method, which is applied in the field of preparation of nano-silver solder paste based on inverse microemulsion system, which can solve the problems of insufficient stability of inverse microemulsion system and easy agglomeration of nanoparticles, and achieve stability Insufficient, solving reunion, enhancing the effect of stability

Active Publication Date: 2019-08-20
GUILIN UNIV OF ELECTRONIC TECH
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  • Application Information

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Problems solved by technology

[0009] In view of the deficiencies in the prior art, the technical problem solved by the present invention is to be able to easily and conveniently judge the formation of the best reversed-phase microemulsion system in the preparation process, and solve the problem of insufficient stability of the reversed-phase microemulsion system and the Particles prone to agglomeration

Method used

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  • A kind of process method for preparing nano-silver solder paste based on inverse microemulsion system

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preparation example Construction

[0030] (1) Preparation of mixed silver nitrate aqueous solution, dissolving silver nitrate particles in distilled water to prepare a certain concentration of silver nitrate aqueous solution, adding dropwise polymer electrolytes of different qualities, to prepare mixed silver nitrate aqueous solutions containing different polymer electrolyte mass percentages;

[0031] (2) Preparation of hydrazine hydrate solution, dissolving the hydrazine hydrate solution in distilled water to obtain a certain concentration of hydrazine hydrate solution;

[0032] (3) Prepare polymer electrolyte aqueous solution inverse microemulsion and draw pseudo-ternary phase diagram;

[0033] Set the amount of surfactant, co-surfactant and oil phase organic matter as m1, m2, m3 respectively, and take different m1 / m2 values, first assume (m1+m2): m3=1:1 is the best ratio, and the surface activity Agent, co-surfactant and oil-phase organic matter were added to the beaker in turn, and mixed silver nitrate aque...

Embodiment 1

[0045] A preparation process of nano-silver solder paste, comprising the steps of:

[0046] 1) Preparation of mixed silver nitrate aqueous solution: Dissolve silver nitrate particles in distilled water to prepare a silver nitrate aqueous solution with a concentration of 0.1mol / L, and add polyethyleneimine (PEI) of different qualities to the silver nitrate aqueous solution to prepare polyethyleneimine containing Imine mass percent is respectively 0.1%, 0.5%, 1%, 5%, 10% mixed silver nitrate aqueous solution;

[0047] 2) Preparation of hydrazine hydrate solution: Dissolve hydrazine hydrate solution in distilled water to obtain 0.5mol / L hydrazine hydrate solution;

[0048] 3) Prepare polymer electrolyte aqueous solution inverse microemulsion and draw pseudo-ternary phase diagram:

[0049]Record the mass of Triton X-100, n-hexanol and n-heptane as m1, m2 and m3 respectively, take m1: m2=(9:1, 8:2, 7:3, 6:4, 5:5, 4:6 , 3:7, 2:8, 1:9), (m1+m2): m3=1:1, add Triton X-100, n-hexanol ...

Embodiment 2

[0055] According to the same method as in Example 1, PVP was used instead of Triton X-100 as the surfactant, n-hexanol was used as the co-surfactant, n-heptane was used as the oil phase organic matter, and polyethyleneimine was used as the stabilizer to form a modified polymer electrolyte. Nano-silver solder paste was prepared from a permanent inverse microemulsion system.

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Abstract

The invention discloses a technique for preventing nano silver soldering paste on the basis of a reversed-phase microemulsion system. The technique comprises the following steps of (1) preparing a mixed silver nitrate aqueous solution; (2) preparing a hydrazine hydrate solution; (3) preparing polymer electrolyte aqueous solution reversed-phase microemulsion and drawing a pseudo-ternary phase diagram; (4) preparing the nano silver soldering paste; and (5) adjusting the viscosity of the soldering paste of the system, and interconnecting the soldering paste to a DBC substrate and an IGBT power chip module. By adopting the technical scheme, the technique has the beneficial effects that the technique is simple to operate, formation of an optimal reversed-phase microemulsion system can be judged conveniently, and the problems that the reversed-phase microemulsion system is poor in stability and nanoparticles are easily agglomerated are solved.

Description

technical field [0001] The invention relates to the technical field of preparation of nanomaterials, in particular to a process method for preparing nano silver solder paste based on an inverse microemulsion system. Background technique [0002] Since the promulgation of the "Made in China 2025" development plan, industrial intelligence and green development have become the theme, and there has been more demand for power semiconductors such as intelligent control chips and IGBTs. With the continuous deepening of IGBT research, it is found that various failure mechanisms of IGBT, including overvoltage, overcurrent, high junction temperature, di / dt and other failure modes, are attributed to the influence of temperature factors. Theory and practice also show that every 10°C increase in the operating temperature of the device, the failure rate will increase by about 1 times. The performance and reliability of high-power semiconductor devices are closely related to the temperatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
Inventor 张平韦荣转姜雄袁朋曾建华
Owner GUILIN UNIV OF ELECTRONIC TECH
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