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Multi-laser-head device

A multi-laser, laser processing head technology, applied in the field of lasers, can solve the problems of affecting processing accuracy and long processing time, and achieve the effects of improving processing accuracy, efficient cutting ability and shortening processing time

Pending Publication Date: 2017-12-15
SHENZHEN H TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the laser processing equipment adopts the setting of a single laser head, which will lead to a longer processing time when using laser processing equipment for processing, and when it is necessary to process materials with non-uniform thickness, it is necessary to replace the laser head. The material undergoes secondary processing, which will affect the accuracy of processing

Method used

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the ...

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Abstract

The invention discloses a multi-laser-head device. The multi-laser-head device comprises a carrier plate, at least one first laser machining head, a second laser machining head and at least one reflector. The first laser machining heads and the second laser machining head are arranged on the carrier plate. The reflectors are rotationally arranged on the carrier plate. Each reflector adjusts the laser beam direction of the corresponding first laser machining head and enables laser beams emitted by the first laser machining head to be on the same plane with laser beams emitted by the second laser machining head. Through the technical scheme, the machining time can be shortened, and the machining precision is improved.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a multi-laser head device. Background technique [0002] Laser processing is a processing technology that uses the characteristics of the interaction between laser beams and substances to perform cutting, welding, surface treatment, drilling and micro-processing of materials (including metals and non-metals). At present, the laser processing equipment adopts the setting of a single laser head, which will lead to a longer processing time when using laser processing equipment for processing, and when it is necessary to process materials with non-uniform thickness, it is necessary to replace the laser head. The material is subjected to secondary processing, which will affect the accuracy of processing. Contents of the invention [0003] The main purpose of the present invention is to provide a multi-laser head device, aiming at shortening the processing time and improving the proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064
CPCB23K26/064B23K26/0643B23K26/38
Inventor 岳国汉
Owner SHENZHEN H TECH CO LTD
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