Electronic device including via and process of forming same

Abstract

The invention discloses an electronic device including a via and a process of forming same. A process of forming an electronic device including providing a substrate having a first surface and a second surface opposite the first surface; etching the substrate along the first surface to define a trench; forming a via within the trench; applying a tape including an adhesive to the first surface, wherein the adhesive of the tape is spaced apart from the first surface by a distance; and operating on the second surface of the substrate.

Description

technical field [0001] The present disclosure relates to electronic devices and methods of forming electronic devices, and more particularly, to electronic devices including trenches and methods of forming the same. Background technique [0002] Through-wafer vias are often used to form connections between different dies in a stacked configuration. Such vias can be formed by forming circuitry at one of the main surfaces of the wafer. The wafer is then thinned by backgrinding or other mechanical operations, and vias are then formed through all or substantially all of the remaining thickness of the wafer. The width of each via is similar to but slightly smaller than the area occupied by the bond pads. The vias are composed of bulk silicon, polysilicon, elemental metals, metal alloys, conductive metal nitrides, or combinations thereof and do not include discrete internal features. In other words, vias are simple microwires. [0003] Traditional methods of making through-waf...

AI Technical Summary

Problems solved by technology

[0003] Traditional methods of making through-wafer vias can cause surface deformation along the die

Cracks, residue and material left on the die can lead to wire bond attachment complications and device problems, or failure

Images