SMD quartz crystal resonator processing method and resonator thereof

Abstract

The invention relates to a processing method of a SMD quartz crystal resonator. The processing method comprises the following steps: firstly providing a complete board resonator semi-finished product, wherein the complete board resonator semi-finished product comprises a base complete board and a cover complete board covered on the base complete board; and then cutting the cover complete board on the complete board resonator to form single base cover boards, and spraying and coating protective layers on the upper surface and sections of each cover board, wherein the method for spraying and coating the protective layer comprises pretreatment process and spraying and coating process; the pretreatment process comprises cleaning, washing, air showering and drying; the spraying and coating process comprises the following steps: firstly spraying and coating the spraying and coating material on the upper surface and section of each base cover board of the resonator complete board by using an electrostatic spraying and coating process to form the coatings, and then performing curing treatment on the coatings to form the protective layers on the upper surface and the section of each base cover board. The processing method disclosed by the invention aims at improving the salt mist resistance and high temperature and high humidity resistance of the SMD quartz crystal resonator under the severe environment. The invention further relates to a resonator prepared by adopting the above-mentioned method.

Description

technical field [0001] The invention relates to a processing method for an SMD quartz crystal resonator and a resonator thereof, belonging to the technical field of resonators. Background technique [0002] SMD quartz crystal resonators are commonly used electronic devices, and their usage is increasing with the development of digital technology. However, at present, SMD quartz crystal resonators have technical obstacles in improving processing efficiency and processing quality in terms of device structure and processing technology. In addition, there are also environmental pollution problems in processing technology. [0003] The cover plate of the traditional single processing SMD quartz crystal resonator generally uses electroless nickel plating or electroplating nickel protective layer, and the cover plate of the existing whole plate processing SMD quartz crystal resonator is also formed by electroless nickel plating. [0004] Electroless nickel plating and electroplati...

AI Technical Summary

Problems solved by technology

[0014] Since the crack line on the front side of the ceramic plate will be slightly deformed after sintering, no matter how high the positioning accuracy of the laser cutting line on the back of the ceramic plate is, it is difficult to align with the crack line 18 on the front of the ceramic plate, causing the edge of a single resonator formed by the lobes to be easily There are problems such as burrs, beveled edges, and damage

[0015] If before the whole ceramic board is sintered, use a cutting knife that is strictly aligned up and down to cut the bottom and front of the whole ceramic board at the same time, forming two symmetrical cracked board lines, because the cracked board lines disconnect the electrodes between the bases. Wire connection, post-processing quartz crystal resonators cannot achieve electroplating

[0016] If after the processing of the quartz crystal resonator is completed, the cracked line on the front and back is cut, because the entire ceramic plate has been sintered and has a high hardness, it cannot be cut with an ordinary cutter, and laser lines must be used. It is difficult to ensure the symmetry of the upper and lower sides, and there are still problems such as burrs, bevels, and damage on the resonator behind the lobes

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