Circuit board with erected inner space
A circuit board and inner space technology, applied in the direction of printed circuit components, etc., can solve the problems of unpredictability of circuit board space, difference in space expected space, difficulty in meeting high-precision circuit boards, etc.
Inactive Publication Date: 2018-01-16
BOARDTEK ELECTRONICS CORP
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Problems solved by technology
[0004] However, in the process of pressing to form the circuit board, the glue used to bond the boards tends to flow into the holes of the above-mentioned internal board, so that after the pressing to form the circuit board, the space inside the circuit board will be different from the expected space. Moreover, the space formed inside the circuit board will not be predictable, and it is difficult to meet the requirements of high-precision circuit boards.
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[0045] see figure 1 , which is an embodiment of the present invention. What needs to be explained first is that the relevant quantities, proportions and shapes presented in the corresponding drawings of this embodiment are only used to specifically illustrate the implementation of the present invention, so as to facilitate understanding of its content. It is not intended to limit the scope of the claims of the present invention.
[0046] The present embodiment is an inner space erected circuit board 100 , which includes a multi-layer board structure 1 and a space truss 2 embedded in the multi-layer board structure 1 . Among them, the multi-layer board structure 1 is an example of a laminated board in this embodiment, and the space truss 2 is used as an example for illustration in this embodiment, but in actual application, it does not take this as an example. limit. Next, the structure of the multi-layer plate structure 1 and the space truss 2 will be described firstly, and ...
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The invention provides a circuit board with erected inner space. The circuit board with erected inner space includes a multilayer board structure and a space truss embedded into the multilayer board structure, wherein the multilayer board structure is provided with multilayer of overlapped board bodies and colloid for bonding any two stacked board bodies; the board bodies are stacked in the stacking direction, and include two outer layer boards and at least one inner layer board between the two outer layer boards; the space truss encloses and defines preset space, and is arranged between the two outer layer boards and abuts against the two outer layer boards; and the space truss is obstructed on the path on which the colloid flows to the preset space. The invention provides a circuit boardin which the demanded internal space is formed accurately.
Description
[0001] This application is a divisional application of a patent application with an application date of May 8, 2014, an application number of 201410193798.6, and an invention title of "Inner Space Erected Circuit Board". technical field [0002] The invention relates to a circuit board, and in particular to a circuit board erected in an inner space. Background technique [0003] Commonly used circuit boards often need to form a specific space inside, but in the past, only the required space type holes are formed in the inner body of the circuit board, so that after the circuit board is formed by pressing, the inner body can pass through The hole achieves the effect of reserving the required space on the circuit board. [0004] However, in the process of pressing to form the circuit board, the glue used to bond the boards tends to flow into the holes of the above-mentioned internal board, so that after the pressing to form the circuit board, the space inside the circuit board...
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IPC IPC(8): H05K1/02
Inventor 李建成
Owner BOARDTEK ELECTRONICS CORP