Mask plate, encapsulation method, structure and display device of oled display substrate

Abstract

The invention provides a mask plate, an OLED display substrate packaging method, structure and display device, belonging to the field of display technology. The mask plate is used to package the OLED display substrate. The OLED display substrate includes a display area, a barrier structure arranged on the edge of the OLED display substrate, and a non-display area between the display area and the barrier structure. The mask plate includes a light-shielding pattern and a light-transmitting pattern. The pattern, the transparent pattern corresponds to at least part of the non-display area of ​​the OLED display substrate. The encapsulation method includes: printing rheological organic material on the OLED display substrate, so that the rheological organic material is formed in the area enclosed by the barrier structure; The OLED display substrate is irradiated with ultraviolet light to cure the rheological organic material located in the non-display area. The technical solution of the present invention can realize the narrow frame of the display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mask plate, a packaging method and structure of an OLED display substrate, and a display device. Background technique [0002] The process steps of the existing flexible OLED packaging structure mainly include: preparing a flexible substrate→making the first gate insulating layer→making the first gate metal layer pattern→making the second gate insulating layer→making the second gate metal layer pattern→making the interlayer Insulation layer→making source-drain metal layer pattern→making flat layer→making anode→making pixel definition layer→making spacer layer→making cathode→making encapsulation film layer, wherein the encapsulation film layer includes organic film and inorganic film stacked, When preparing an organic film, the rheological organic material, such as acrylic material, is inkjet printed in the filled area surrounded by barriers. The rheological organic material is...

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Problems solved by technology

[0002] The process steps of the existing flexible OLED packaging structure mainly include: preparing a flexible substrate→making the first gate insulating layer→making the first gate metal layer pattern→making the second gate insulating layer→making the second gate metal layer pattern→making the interlayer Insulation layer→making source-drain metal layer pattern→making flat layer→making anode→making pixel definition layer→making spacer layer→making cathode→making packaging film layer, wherein the packaging film layer includes organic and inorganic films stacked, When preparing organic thin films, rheological organic materials, such as acrylic materials, are inkjet printed in the filled area surrounded by barriers. The rheological organic materials are automatically leveled and solidified in the filled area to form an organic film. Due to the thickness of the organic film Therefore, the climbing distance of its edge is relatively large, that is, the distance from the edge of the display area to the barrier is relatively large, which is not conducive to the realization of a narrow frame and no frame of the display device.

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