Additive for flux plating, flux solution and hot-dip plating method

A technology of additives and fluxing solution, which is applied in hot-dip plating process, organic chemistry, coating, etc., and can solve problems such as insufficient technical effects

Active Publication Date: 2021-10-22
JIANGSU FEITUO INTERFACE ENG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the additives disclosed in the prior art still have certain technical effects.

Method used

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  • Additive for flux plating, flux solution and hot-dip plating method
  • Additive for flux plating, flux solution and hot-dip plating method
  • Additive for flux plating, flux solution and hot-dip plating method

Examples

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Effect test

Embodiment 1-14

[0033] In order to verify the effect of the additive of the present invention, the applicant has carried out experimental verification respectively, and the contents of the experiment are as follows:

[0034] 1. Analysis of plating effect;

[0035] (1) preparation of plating flux;

[0036] Add water into the plating bath, then add 110-120g zinc chloride per liter of water, add zinc chloride and ammonium chloride, and additives (if any) at a ratio of 150-160g ammonium chloride to dissolve, then heat to 60°C to obtain a plating flux. Take a Q235 steel sheet with the same specification of 5cm*10cm*0.3cm, pickle, wash with water in turn, weigh after drying, and immerse in different fluxing solutions for 20 minutes.

[0037] After taking it out, observe the drying condition of the surface moisture, and record the drying time. After the moisture is dried, weigh and calculate the deposition amount of the flux salt film, and observe the state of the salt film. This experiment inve...

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Abstract

The present invention relates to an additive for plating flux, a plating flux solution and a hot-dip plating method in the field of chemical industry. The additive for plating flux contains a compound of the following formula I: (I); wherein R1 is C12- 16 alkyl; R2 is methyl or hydroxypropyl; R3 is one of hydroxyethyl, hydroxypropyl, and dihydroxypropyl; R4 is one of methyl, hydroxyethyl, and dihydroxypropyl , X is one of Cl, Br, I. The additive of the present invention can make the interface wettability better between the molten coating metal and the workpiece, reduce the amount of plating flux adhesion while preventing the occurrence of missing plating, accelerate the drying process, reduce the risk of accidents such as burns, and shorten the immersion plating time , reduce material consumption.

Description

Contents of the invention [0001] The invention belongs to the technical field of chemical industry, and in particular relates to an additive for plating flux, a plating flux solution and a hot-dip plating method. Background technique [0002] The surface of the metal material is coated with other metal or non-metal protective layer, which can effectively prevent the corrosion of the base metal material. The hot-dip metal plating process, including hot-dip galvanizing, hot-dip galvanized aluminum alloy, and hot-dip aluminum plating, mostly adopts the solvent method. The principle is to immerse the workpiece in the molten metal to be plated, lift the workpiece, and its surface will be ready after cooling. Covered with a thin layer of coating, the corrosion resistance is greatly improved, materials and resources can be saved, and good economic and environmental benefits can be exerted. The quality of the coating directly affects the corrosion resistance. Therefore, before the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/02C23C2/38C07C215/40
CPCC07C215/40C23C2/02C23C2/38
Inventor 陈春雷周汉涛郑建周德龙
Owner JIANGSU FEITUO INTERFACE ENG TECH CO LTD
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