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Cooling device

A technology for heat dissipation equipment and heat dissipation components, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, printed circuits, etc.

Inactive Publication Date: 2018-03-23
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the industry, after dismantling the boards, they will be stacked on the transport vehicle for heat dissipation, so the heat dissipation space is small, making the heat dissipation effect extremely poor, which will also lead to excessive changes in the expansion and contraction coefficient and affect the quality of the PCB board
The industry also adopts cooling racks to dissipate heat. There are still many inconveniences in the way of cooling racks. The natural heat dissipation time of the cooling racks is extremely long, and the cooling racks take up a lot of space, which affects the operating space. The cooling racks loaded with PCB boards are extremely heavy. , it is difficult to move, which makes the heat dissipation operation very troublesome, time-consuming and labor-intensive
[0003] The existing heat dissipation method after the PCB board is pressed has the problems of long time consumption and poor heat dissipation effect

Method used

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  • Cooling device
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Embodiment Construction

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0024] It should be noted that when an element is referred to as being “fixed” to another element, it can be...

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PUM

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Abstract

A cooling device includes a frame, a first cooling component, a flipping component, a second cooling component, and a plurality of support components. The first cooling component and the second cooling component are located at two sides of the flipping component respectively. The first cooling component includes a plurality of first cooling fans disposed on the frame. The flipping component includes a flipping rotating motor, a flipping belt, and a flipping rotating shaft. A plurality of grooves are evenly arranged on the outer circumference of the flipping rotating shaft. Protrusions are formed between every two adjacent grooves. The support components are disposed on the protrusions one to one. The support component includes a plurality of support members. The second cooling component includes a plurality of second fans disposed on the frame. The cooling device can dissipate heat through the cooling fans, can shorten the cooling time and can dissipate heat from both sides of a PCB. In addition, the PCB can be automatically flipped and the cooling is convenient.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a cooling device. Background technique [0002] After the PCB board is laminated, it will be disassembled from the large material to the size of the work piece, and then the lamination process will be completed after the target edge is shot. In the industry, the boards are generally stacked on the transport vehicle for heat dissipation after dismantling, so that the heat dissipation space is small, making the heat dissipation effect extremely poor, which will also cause excessive changes in the expansion and contraction coefficient and affect the quality of the PCB board. The industry also adopts cooling racks to dissipate heat. There are still many inconveniences in the way of cooling racks. The natural heat dissipation time of the cooling racks is extremely long, and the cooling racks take up a lot of space, which affects the operating space. The cooling racks ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K7/20
CPCH05K3/00H05K7/20136H05K2203/1121
Inventor 许校彬陈金星董恩佳张武伦沈永龙
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD