LED packaging method, LED module group and LED device thereof

Abstract

The invention discloses an LED packaging method, an LED module group and an LED device thereof. Packaging and printing are performed on an LED substrate having multiple LED chips through a steel printing mesh, and the concrete steps are listed as follows: step S1, alignment and installation: an LED packaging and printing device is provided, the LED packaging and printing device is provided with afirst clamping device used for fixing the LED substrate and a second clamping device used for fixing the steel mesh, the first clamping device and the second d clamping device can relatively move, theLED substrate is arranged below the steel mesh and the steel mesh is enabled to be aligned with the position of the LED substrate, and then accurate positioning is performed through the steel mesh and the positioning device on the corresponding position of the LED substrate; step S2, glue scraping: the glue is scraped to the steel mesh through a glue scraping device so that the mesh holes are enabled to be fully filled with the glue; and step S3, formation and separation: the LED substrate and the steel mesh are separated. The packaging technology is simple and the formed product has great consistency so as to be suitable for large-scale batch production.

Description

technical field [0001] The invention relates to the technical field of LED processing, in particular to an LED packaging method. Background technique [0002] In the existing LED packaging methods, two methods are generally used for packaging, one is molding or plastic sealing, and the other is dispensing. The molding or plastic sealing method is to order a set of molds first, and use a molding machine. Put in glue and substrate, cure and form at high temperature, and complete chip packaging after demoulding; the way of dispensing glue is to use high thixotropic glue, extrude a certain amount of glue through a glue dispenser, and complete LED chip packaging after high temperature baking. In the molding process, the manufacturing mold is long, the cost is high, and the unit price of the equipment is high; the glue solidifies rapidly under the action of high temperature, the stress is large, and the reliability is low; after the substrate is packaged, there is flow channel glu...

AI Technical Summary

Problems solved by technology

In the molding process, the manufacturing mold is long, the cost is high, and the unit price of the equipment is high; the glue solidifies quickly under the action of high temperature, the stress is large, and the reliability is low; after the substrate is packaged, there is flow channel glue, and the cutting process speed cannot be improved

In the dispensing process, the packaging efficiency is very slow, and mass production requires many dispensing machines; the consistency of molded products is poor

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