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Drywall joint tape with dual purpose adhesive backing

A technology for bonding tapes and adhesive layers, applied in the direction of bonding methods, film/sheet adhesives, adhesives, etc., which can solve problems such as cracking of caulking mixtures

Inactive Publication Date: 2018-05-11
USG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, over time, the joint compound covering the fiberglass tape may crack due to minor movement of the framing due to humidity changes and foundation settlement

Method used

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  • Drywall joint tape with dual purpose adhesive backing
  • Drywall joint tape with dual purpose adhesive backing
  • Drywall joint tape with dual purpose adhesive backing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The joint tape of the present invention comprises an adhesive layer that enables the tape to be easily applied and secured over the joint between adjacent wallboard panels and to form a bond with the wallboard panels after applying the joint compound to the joint. Once worn, the bond will strengthen over time.

[0020] see now Figure 1A , 1B and 2 to 5, an embodiment of the splicing tape of the present invention (generally designated by reference numeral 20) comprises a base substrate 22 made of a woody or cellulosic material shaped as a thin strip of specified length and width. Strip. In one embodiment, base substrate 22 is made of paper. In one embodiment, the width of the splice strip is 1.75 to 2.5 inches and the thickness of the splice strip is .007 to .012 inches. It should be appreciated that bonding strip 20 (and, more specifically, base substrate 22 ) may be of any suitable width and of any suitable thickness. Furthermore, the base substrate 22 can be made...

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PUM

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Abstract

A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer, in preferred embodiments the second adhesive beingactivatable by water. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form asecure bond with the wallboard panels.

Description

Background technique [0001] The present invention relates to a wallboard joint tape, and more particularly to a wallboard having an adhesive backing that enables the tape to be easily applied to the joint between adjacent wallboard panels and forms a bond with the wallboard panels Jointing the tape, the bond strengthens over time after the joint compound is applied to the tape. [0002] The joint between adjacent wallboard panels is typically covered with a joint compound to ensure that the joint is not visible after installation, thereby enhancing the appearance of the resulting wall. Caulk compounds are available in a variety of forms, including pre-mixed forms that are pre-mixed and can be applied immediately to surfaces, and powder forms that must be mixed with water before application. In either case, the caulk compound was first applied to the joint, and then the paper tape without the adhesive backing was placed over the joint. Next finish the tape with another layer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/21E04F13/04C09J7/30C09J7/32C09J7/38
CPCE04F13/042C09J2400/283C09J7/38C09J7/385C09J7/30C09J7/21C09J7/32C09J2301/204C09J2301/208C09J2301/306C09J2301/302C09J2401/006C09J5/04E04F19/022
Inventor G·罗森塔尔P·L·哈格罗夫J·爱德考克R·涅格里
Owner USG CORP