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Component carrier with adhesion promoting shape of wiring structure

A component bearing and wiring structure technology, which is applied in the direction of improving the metal adhesion of insulating substrates, printed circuit components, semiconductor/solid device components, etc., can solve the problems of component carrier reliability degradation and other issues

Active Publication Date: 2018-05-25
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Delamination (delamination, debonding) between adjacent layers of a layer stack of a component carrier may deteriorate the reliability of the component carrier

Method used

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  • Component carrier with adhesion promoting shape of wiring structure
  • Component carrier with adhesion promoting shape of wiring structure
  • Component carrier with adhesion promoting shape of wiring structure

Examples

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Embodiment Construction

[0056] The illustrations in the figures are schematic. In different figures, similar or identical elements have the same reference signs.

[0057] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some basic ideas on which the exemplary embodiments of the present invention have been developed will be summarized.

[0058] Exemplary embodiments of the present invention provide a technique capable of improving attachment of a component carrier such as a thin wire wiring structure of a PCB.

[0059] Adhesion between adjacent layer structures in a component carrier such as a PCB can be achieved by mechanical attachment. This mechanical adhesion can conventionally be improved by increasing the roughness of the surface of the adjacent layer structure which should exhibit good adhesion. Thus, in order to achieve proper adhesion between adjacent surfaces in the component carrier, the surface roughness between the layer structures ...

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PUM

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Abstract

A component carrier (100) is provided, and comprises a base structure (102) and an electrically conductive wiring structure (106) on the base structure (102), wherein the wiring structure (106) has anonrectangular cross-sectional shape configured so that an adhesion promoting constriction (108) is formed by at least one of the group consisting of the wiring structure (106) and a transition between the base structure (102) and the wiring structure (106).

Description

technical field [0001] The invention relates to a component carrier, a method of producing the component carrier and a method of use. Background technique [0002] Against the background of the continuous development of product functions of component carriers equipped with one or more electronic components and the increasing miniaturization of such electronic components and the increasing number of electronic components to be mounted on component carriers such as printed circuit boards, there is Increasingly more powerful arrayed components or packages of several electronic components are being used having multiple contacts or connections with increasingly smaller spacing between the contacts. Removing the heat generated by such electronic components and the component carrier itself during operation is becoming an ever-increasing problem. At the same time, the component carrier should be mechanically stable and electrically reliable in order to be able to operate even under...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/38
CPCH05K1/11H05K3/38H05K2201/098H05K2201/09218H01L21/4846H05K1/0242H01L23/498H05K1/0306H05K1/181H05K3/382H05K2201/10689
Inventor 汉内斯·沃拉贝格尔
Owner AT & S AUSTRIA TECH & SYSTTECHN AG