Instrument board female die shrink wrap structure and assembling method thereof
A technology of instrument panel and negative mold, applied in the direction of instrument panel, transportation and packaging, vehicle parts, etc., can solve the problems of high unit price cost and large size of instrument panel negative mold, achieve weight reduction, reduce skin area, mold low cost effect
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[0033] The specific embodiment of the present invention will be described in further detail by describing the embodiments below with reference to the accompanying drawings, the purpose is to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and contribute to its implementation.
[0034] like Figure 1 to Figure 5 As shown, the present invention specifically relates to an instrument panel female mold blister structure, including an instrument panel skeleton 2, the instrument panel female mold blister structure also includes a female mold blister cover 1, a female mold blister cover 1 and an instrument panel The board frame 2 is detachably connected. Through this detachable connection method, the female mold blister cover can be disassembled within the reachable range of the automobile dashboard, and the female mold skin area is reduced within the reachable range, which red...
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