Loudspeaker module

A speaker module and speaker technology, applied in the direction of sensors, electrical components, etc., can solve the problems such as the decrease of the sound quality and sensitivity of the speaker module, affecting the acoustic performance of the speaker module, and the unsmooth sound of the speaker module, so as to optimize the acoustic performance. , to ensure air tightness, good sound quality

Inactive Publication Date: 2018-06-29
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For modules with side sound output structure, limited by the design of the diaphragm surround, the sound channel space above the surround is relatively narrow, and the sound of the speaker module is not smooth, which affects the acoustic performance of the speaker module and makes the speaker module Group sound quality and sensitivity drop

Method used

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  • Loudspeaker module
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Examples

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Embodiment Construction

[0025] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0026] In order to increase the sound channel space of the loudspeaker and optimize the acoustic performance of the loudspeaker, the present invention provides a loudspeaker module, such as figure 1 , 2 As shown in and 3, the side sound speaker module is taken as an example for introduction, which includes a module housing 1 with a cavity and a speaker unit accommodated in the cavity, and the speaker unit connects the cavity Divided into a front chamber and a rear chamber; the side wall of the module housing 1 is provided...

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Abstract

The invention discloses a loudspeaker module. The loudspeaker module comprises a module shell with a cavity and a loudspeaker monomer accommodated in the cavity, and the loudspeaker monomer divides the cavity into a front cavity and a back cavity; the side wall of the module shell is opened with a sound outlet hole connecting the front cavity; the module shell comprises at least a first shell anda second shell which are combined and fixed together to form a cavity; the loudspeaker monomer comprises a vibration film; the vibration film comprises a folding ring part which is bent towards the direction near the first shell; a through hole running through the inner and outer surfaces of the first shell vertically is arranged in the position corresponding to the folding ring part on the firstshell; and a sealing part covering the through hole is combined and fixed on the outer surface of the first shell. The invention increases the space of the sound outlet channel, improves the acousticperformance of the loudspeaker module, and improves the sound quality of the loudspeaker.

Description

technical field [0001] The invention relates to the technical field of acoustic-electric conversion. More specifically, it relates to a speaker module. Background technique [0002] With the rapid development of science and technology, consumers have higher and higher requirements for electronic products. Based on consumers' requirements for electronic products, the design of mobile phones and other electronic products tends to be thinner and lighter. As an important acoustic component of portable electronic equipment, the sounder module is used to complete the conversion between electrical signals and acoustic signals, and is an energy conversion device. [0003] Currently, speaker modules are becoming thinner and thinner due to the thinner and lighter configuration requirements of electronic products. For modules with side sound output structure, limited by the design of the diaphragm surround, the sound channel space above the surround is relatively narrow, and the soun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/06H04R9/02
Inventor 张庆一陈钢
Owner GOERTEK INC
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