IC carrier plate outline machining positioning method and equipment adopted in same

Abstract

The invention discloses an IC carrier plate outline machining positioning method and equipment adopted in the IC carrier plate outline machining positioning method, and belongs to the technical fieldof IC carrier plate machining. The IC carrier plate outline machining positioning method and the equipment adopted in the IC carrier plate outline machining positioning method aim at achieving the technical purpose of improving outline milling size precision. According to the adopted technical scheme, the IC carrier plate outline machining positioning method comprises the steps that a milling machine table face with an electromagnetic attraction function is used as a tool plate, a pin provided with a base at the lower end is sleeved with a positioning hole of an IC carrier plate to be machinedand placed on the tool plate together, the tool plate fixes the base of the pin through electromagnetic attraction, the IC carrier plate on the pin is taken down, the pin is sleeved with the IC carrier plate again after the base of the pin is sleeved with a base plate, finally, a CCD system is operated to recognize the position of the IC carrier plate, the expansion-shrinkage ratio is automatically calculated according to the graph position for carrying out corresponding compensation on the program, and a milling machine is started to machine the IC carrier plate. The IC carrier plate outlinemachining positioning method and the equipment adopted in the IC carrier plate outline machining positioning method are used for outline machining positioning of other high-end IC carrier plates/PCBs.

Description

technical field [0001] The invention relates to a method for processing and locating the shape of an IC carrier board and the equipment used therein, which belong to the technical field of IC carrier board processing, and specifically relate to the processing and positioning of the shape of an IC carrier board for communication and other high-end IC carrier boards / PCB boards. Background technique [0002] IC substrates usually have high requirements on the accuracy of external dimensions (+ / -0.1mm). In addition, with the recent rise of cloud computing and big data, IC substrates for communication have also been vigorously developed. The requirement is usually + / -0.05mm. [0003] At present, the shape processing of the IC carrier board adopts the method of driving the pin into the tool board for positioning, as follows figure 2 As shown: first drill positioning holes on the tool board and the backing board, drive the pins into the tool board to a certain depth, then place th...

AI Technical Summary

Problems solved by technology

This processing method has the following problems: 1. After the tool board has been used for a period of time, the board surface is riddled with holes and cannot be reused, and can only be scrapped; If the positions of the pins are inconsistent, the board cannot be installed or the accuracy deviation will be caused by the expansion and contraction of the board; 3. Due to the deviation in the way of manual pinning, and the loading and unloading of the board is not easy to operate, the pins are easy to be biased, which affects the processing accuracy

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