Chip failure analysis method and device
A failure analysis and chip technology, applied in measurement devices, material analysis, material analysis by optical means, etc., can solve the problems of not finding the cause of failure, taking a long time, and having little effect.
Active Publication Date: 2021-01-08
CSMC TECH FAB2 CO LTD
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Problems solved by technology
In the previous analysis, there is no good method for this kind of failure. The analysis is carried out by means of key-level morphology observation, alignment comparison, and VC voltage contrast image observation. The whole process takes a long time and is Little effect, often can not find the real cause of failure
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[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of ...
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The invention relates to a chip failure positioning method and a chip failure positioning apparatus. According to the chip failure positioning method, a light emitting microscope is connected to a heating table disk through a machine table connection plate, such that the machine table connection plate is positioned between the base of the light emitting microscope and the base of the heating tabledisk; a thermal insulation washer is arranged between the machine table connection plate and the heating table disk; the heating table disk is arranged at the position of the sample table of the light emitting microscope; a chip to be tested is placed on the table surface of the heating table disk, and the temperature range of the heating table disk is set, wherein the chip to be tested is at thetest temperature, and the temperature range is 140-160 DEG C; and the bright spot on the chip to be tested is the failure position of the chip to be tested. According to the present invention, by combing with the heating table disk, the chip to be tested is at the testing temperature, and the failure position of the chip to be tested is positioned by the light emitting microscope.
Description
technical field [0001] The invention relates to chip failure location, in particular to a chip failure location method and device in a high-temperature environment. Background technique [0002] At present, the conventional methods used in the industry for the electrical analysis of failed circuits are mainly to measure leakage and EMMI (light emission microscope) positioning. This process is usually carried out at room temperature, and some leakages caused by failures need to be detected under high temperature working conditions. be embodied. With the development of technology and the improvement of IC integration, millions of circuits are integrated on one chip. Failure analysis without providing direction through electrical positioning is like finding a needle in a haystack. [0003] The room temperature EMMI machine can provide conventional failure location work, but it can't do anything for dies that have no leakage at room temperature but fail at high temperature leak...
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IPC IPC(8): G01N21/95
CPCG01N21/9501
Inventor 韦俊陈倩
Owner CSMC TECH FAB2 CO LTD