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Light emission microscope sample

A light emission microscope and sample technology, which is used in optical testing for flaws/defects, electronic circuit testing, semiconductor/solid-state device testing/measurement, etc. The adhesive is easy to contaminate the surface of the chip and other problems, so as to achieve the effect of convenient detection, convenient and fast preparation, and high quality

Inactive Publication Date: 2010-08-11
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

[0005] In the existing light emission microscope samples, transparent adhesives are required to stick the chip on the transparent substrate, which can easily cause air bubbles between the back of the chip and the transparent substrate, which will have a great impact on the pictures obtained from the back of the light emission microscope sample, so it is obtained The quality of the light emission microscope sample is not good; after the light emission microscope analysis, the light emission microscope sample is removed from the transparent substrate, the adhesive is easy to stain the surface of the chip, which has a great impact on the reprocessing of the subsequent failure analysis

Method used

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Embodiment Construction

[0020] Because the existing light emission microscope sample needs to use transparent adhesive because the chip is stuck on the transparent substrate, it is easy to cause air bubbles between the back of the chip and the transparent substrate, which will have a great impact on the image obtained from the back of the light emission microscope sample, so The quality of the obtained light emission microscope sample is not good; after the light emission microscope analysis, the light emission microscope sample is removed from the transparent substrate, the adhesive is easy to stain the surface of the chip, which has a great impact on the reprocessing of the subsequent failure analysis. In the present invention, the solid-mounting component is used to carry the chip and fix the chip on the transparent substrate. Since there is no need to use an adhesive to bond the chip and the transparent substrate, no air bubbles will be generated, and the image obtained from the back of the light e...

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Abstract

A photo emission microscope sample comprises: a chip which has a first bonding pad; a PCB board which has a second bonding pad electrically connected with the first bonding pad; and a fixing carrying assembly which is used for carrying and fixing the chip. The photo emission microscope sample further comprises: a transparent base plate which passes through an embedding hole of the PCB board and bears the chip; a fixing assembly which is used for fixing the chip mechanically onto to the transparent base plate, wherein the transparent base plate and the PCB board are interlocked and in parallelwith each other; and an inversion assembly which is used for inverting the PCB board around a shaft and locking the PCB board. The photo emission microscope sample has quick preparation and high quality.

Description

technical field [0001] The invention relates to the technical fields of semiconductor manufacturing and material analysis, in particular to light emission microscope samples. Background technique [0002] With the advancement of material science, the microstructure has a great influence on the properties of the material itself. Therefore, in order to understand the properties of the material itself, it is necessary to have good microscopic analysis techniques and tools. General optical microscopes are limited by factors such as light wavelengths and aberrations, and the magnification is limited. Based on the demand for higher magnifications, new "microscopic" equipment is slowly developing, and light emission microscopes are one of them. [0003] Light emission microscopy is a new type of defect localization analysis technology with high sensitivity and high resolution developed in the 1990s. With the continuous decrease of the line width of semiconductor devices, optical e...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/88G01R31/308H01L21/66
Inventor 梁山安张启华郭志蓉廖炳隆
Owner SEMICON MFG INT (SHANGHAI) CORP