Light emission microscope opposite side sample fixer

Abstract

The light transmitting microscope back sample fixture mainly comprises the sample bearing base plate, sample fixing pole and at least three movable threaded cushion, middle of the sample bearing plate embedded with transparent glass as the location for bearing sample. It does not need thermosol, without pollution, being material saving and convenient in use.

Description

Technical field [0001] The invention relates to a light emission microanalysis technology, in particular to a design scheme of a sample holder of a light emission microscope. Background technique [0002] Optical emission microscopy (EMMI) is a new type of high-sensitivity, high-resolution defect location analysis technology developed in the 1990s. With the continuous decrease of the line width of semiconductor devices, light emission microscopes have been widely used in the analysis of failure points such as leakage, breakdown, and hot carriers in integrated circuits and discrete devices and the analysis of failure mechanisms. [0003] As a new type of high-resolution micro-defect locating technology, light emission microscopy technology can quickly and accurately locate device failure defects in a large range, so it is widely used in device failure analysis. [0004] In semiconductor devices with leakage, breakdown, and hot carrier effects, their failure points produce light-em...

AI Technical Summary

Problems solved by technology

However, there are two main problems in the processing process: one is that there are air bubbles between the back of the chip and the glass due to the glue, which has a great negative impact on the backside capture during EMMI analysis; the other is that after the EMMI analysis is completed, the The process of removing the chip from the glass slide can easily contaminate the surface of the chip, because the hot melt is difficult to clean when the chip is removed, and it sticks to the surface of the chip, which makes it difficult for subsequent analysis. Usually, the failure analysis step after EMMI analysis requires a chip Deprocessing is used to remove chip structures such as protective layers, insulating layers, and metal layers. If the chip surface is contaminated, it will have a great negative impact on chip deprocessing.

[0007] Limited by the inherent sample preparation method, the above problems are difficult to avoid

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