Micro-size chip fixing device

Abstract

The invention relates to the field of failure analysis of the semiconductor manufacturing industry, and particularly relates to a fixing device applied to a light emission microscope. The micro-size chip fixing device comprises a base and a plurality of check blocks located on the base, wherein the base and the plurality of check blocks form a bearing body together; and the plurality of check blocks form a plurality of sample slots thereamong, and each two adjacent check blocks are provided with a sliding block therebetween. The structure provided by the invention enables a chip testing structure not to be covered by an adhesive tape to affect stabbing of a probe, and the chip surface is not contaminated. Meanwhile, the reverse side of a chip is fully contacted with a base of the fixing device, thereby not influencing lens focusing of the light emission microscope because of inclination. Furthermore, when the probe stabs, relative sliding does not occur between a probe point and the chip, and the whole operation process does not involve chemical substances, thereby being safe and harm-free. The micro-size chip fixing device can help an analyst to carry out defect positioning analysis rapidly, efficiently and safely, and improves the failure positioning rate and the success rate.

Description

technical field [0001] The invention relates to the field of failure analysis in the semiconductor manufacturing industry, in particular to a micro-sized chip fixing device. Background technique [0002] Photo Emission Microscope (hereinafter referred to as PEM) is a very sensitive chip defect positioning tool. When there are excessive electron-hole generation formulas inside the chip, infrared photons will be generated due to electron-hole transitions. This can be detected by PEM. When the chip failure is due to oxide layer collapse, electrostatic discharge damage, latch-up effect, hitting free and saturated transistors, excess electron-hole pairs will be generated, and the accompanying photons due to electron-hole transitions can be generated by the PEM Accurately locate the fault location. [0003] When using the PEM to locate the failure of a micro-sized chip, the existing method is to fix the two ends of the chip on a transparent glass slide with adhesive tape, and th...

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Problems solved by technology

[0004] 1. Since the length of the chip is too small, it is easy to cover the test structure when pasting the tape on both ends of the chip, which will affect the needle-pricking and power-on process for analyzing the structure;

[0005] 2. Due to the small area of ​​the bottom of the chip, when the tape is used to fix it, the bottom of the chip cannot fully contact the slide or sample stage, which is easy to cause inclination, causing the PEM lens to fail to focus on the structure to be analyzed, thus affecting the accuracy of the analysis results;

The contact pressure of the probe will cause the chip to slide, resulting in the incomplete contact between the probe and the chip, resulting in the inability to apply electrical conditions;

[0007] 4. The surface area of ​​the smallest chip is only a few square millimeters, it is very inconvenient to operate, it is easy to touch and contaminate the target area on the chip, and it will leave residue when the tape is peeled off

The patent document does not mention how to fix the micro-sized chip

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