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Oxazine compound, composition and cured product

A technology of compound and composition, applied in the direction of organic chemistry, electric solid devices, chemical instruments and methods, etc., can solve problems such as inability to reach, and achieve the effect of excellent low hygroscopicity and excellent dielectric properties

Active Publication Date: 2020-09-18
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when they are used, components derived from aniline are generated as decomposition gases during the ring-opening of oxazine, so the thermal decomposition resistance, which is an index of long-term thermal durability, cannot reach the level required in recent years. Expect further improvement and performance improvement

Method used

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  • Oxazine compound, composition and cured product
  • Oxazine compound, composition and cured product
  • Oxazine compound, composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0208] [Example 1] Synthesis of benzoxazine compound (A-1)

[0209] In a 4-necked flask equipped with a dropping funnel, a thermometer, a stirring device, a heating device, and a condensing reflux tube, nitrogen gas was circulated, and 147.2 g (1.0 moles) of 4-propargyloxyaniline, 4-(N,N- 185.2 g (1.0 mol) of dipropargylamino) phenol was dissolved in 750 g of toluene, 63.9 g (2.0 mol) of 94% paraformaldehyde was added, the temperature was raised to 80° C. while stirring, and the reaction was carried out at 80° C. for 7 hours. After the reaction, transfer to a separatory funnel and remove the aqueous layer. Thereafter, the solvent was removed from the organic layer under reduced pressure under heating to obtain 347 g of a benzoxazine compound (A-1).

[0210] 1 H-NMR shows the peaks of 7.07ppm-6.62ppm (7H), 5.29ppm (2H), 4.68ppm-4.52ppm (4H), 4.01ppm (4H), 3.13ppm (2H), 2.80ppm (H), 13 C-NMR showed 151.6ppm, 147.5m, 142.4ppm, 141.4ppm, 121.1ppm, 119.2ppm, 116.4ppm, 116.3ppm, ...

Embodiment 2

[0212] [Example 2] Synthesis of benzoxazine compound (A-2)

[0213] In a 4-necked flask equipped with a dropping funnel, a thermometer, a stirring device, a heating device, and a condensing reflux tube, nitrogen gas was circulated, and 184.2 g (1.0 moles) of 4-(N,N-dipropargylamino) aniline, 185.2g (1.0 mole) of 4-(N,N-dipropargylamino)phenol was dissolved in 750g toluene, and 63.9g (2.0 mole) of 94% paraformaldehyde was added, and the temperature was raised to 80°C while stirring. °C for 7 hours. After the reaction, transfer to a separatory funnel and remove the aqueous layer. Thereafter, the solvent was removed from the organic layer under reduced pressure under heating to obtain 381 g of a benzoxazine compound (A-2).

[0214] 1 H-NMR shows the peaks of 7.25ppm-6.62ppm (7H), 5.28ppm (2H), 4.51ppm (2H), 4.09ppm-3.84 (8H), 3.14ppm-2.91 (4H), 13 C-NMR showed 147.6ppm, 141.9m, 141.4ppm, 128.2ppm, 121.3ppm, 118.9ppm, 117.1ppm, 116.4ppm, 116.3ppm, 114.9ppm, 79.9ppm, 79.8ppm, 7...

Embodiment 3~4 and comparative example 1

[0224] [Examples 3-4 and Comparative Examples 1-2] Preparation of compositions and molded articles

[0225] The benzoxazine compounds (A-1, A-2, B-1) obtained in Examples 1, 2 and Comparative Synthesis Example 1, the propargyloxy-containing compound (B-1) obtained in Comparative Synthesis Example 2 2), comparative dihydrooxazine compound ("P-d type benzoxazine" (reaction product of 4,4'-diaminodiphenylmethane, formalin and phenol) manufactured by Shikoku Chemical Industry Co., Ltd.), phenolic resin ( "TD-2131" phenol novolac resin manufactured by DIC Corporation) was blended at the ratio shown in Table 1 to prepare a composition.

[0226] A cured product was produced by applying the following conditions to this composition.

[0227]

[0228] Curing conditions: heat curing at 170°C for 2 hours, heat curing at 200°C for 2 hours, and then heat curing at 250°C for 2 hours

[0229] Plate thickness after forming: 2.4mm

[0230] Various physical properties of the cured product wer...

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Abstract

The present invention provides an oxazine compound with a specific structure, which is characterized in that it has an aromatic ring structure and a plurality of specific groups with a carbon-carbon triple bond structure. In addition, the present invention provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. In addition, the present invention provides a composition for heat-resistant materials and a composition for electronic materials characterized by comprising a composition containing the oxazine compound of the present invention.

Description

technical field [0001] The present invention relates to an oxazine compound excellent in heat resistance, dielectric properties, and low hygroscopicity, and a composition, cured product, and laminate containing the oxazine compound. Moreover, it also relates to the heat-resistant material and heat-resistant member containing this oxazine compound, an electronic material, and an electronic member. Background technique [0002] Various resin materials such as epoxy resin, cyanate resin, bismaleimide-triazine resin, benzoxazine resin, etc. However, in recent years, in various applications, especially advanced material applications, further improvements in performance such as heat resistance and dielectric properties, and materials and compositions that exhibit both of these and low hygroscopicity are required. [0003] Among them, benzoxazine, which can be easily prepared by combining phenolic compounds, amine compounds, and formaldehyde, undergoes ring-opening polymerization ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G14/073B32B15/08C07D265/16C08J5/24H01L23/29H01L23/31H05K1/03
CPCB32B15/08H01L23/29H01L23/31H05K1/03C07D265/16C08J5/244C08J5/243H01L23/295H05K1/0373H05K1/09
Inventor 有田和郎下野智弘大津理人山口纯司铃木悦子
Owner DIC CORP