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Flame-retardant epoxy resin composition and liminate made with same

A technology of epoxy resin and composition, which is applied in the direction of synthetic resin layered products, layered products, transportation and packaging, etc., which can solve the problems of non-flammability, increased dielectric constant, and reduced processing performance of laminates. , to achieve high flame retardancy, improved flame retardancy, and high thermal strength

Inactive Publication Date: 2004-10-06
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The first problem is the reduced processability of the resulting laminate
In this regard, it is described on pages 270 and 271 of "Latest Techniques of Flame Retardant and Flame Retardation" (published by Technical Information Institute Co., Ltd. on July 30, 1999) , adding a large amount of aluminum hydroxide (75% by mass relative to the total epoxy resin composition) can reach UL 94 V-0, but such an addition is unrealistic in practical applications, and "in printed circuit boards Problems can arise in stamping and drilling in production and welding in component assembly
[0007] The second problem is that the dielectric constant increases and the moisture resistance and soldering heat resistance decrease
[0011] However, the above-mentioned resin compositions, which are designed to be suitable for semiconductor device packaging applications, do not have sufficient flame retardancy when used in applications such as laminates.

Method used

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  • Flame-retardant epoxy resin composition and liminate made with same
  • Flame-retardant epoxy resin composition and liminate made with same
  • Flame-retardant epoxy resin composition and liminate made with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0190] 33.48 mass % phenol biphenyl aralkyl epoxy resin (epoxy resin 1), 25.43 mass % phenol biphenyl aralkyl resin (phenolic resin 1), 40.0 mass % aluminum hydroxide, 0.80 mass % silane coupling To a mixture consisting of a curing accelerator catalyst of 0.29% by mass of a curing accelerator, methyl ethyl ketone was added to prepare an epoxy resin varnish containing 65% by mass of non-volatile components.

[0191] The epoxy varnish was continuously impregnated into the glass fabric by coating, and then dried in an oven at 120° C. to prepare a prepreg. Eight such prepregs were laminated together to prepare a laminate. At 170°C, 40kg / cm 2 The laminate was hot pressed under pressure for 20 minutes and then post-cured at 175° C. for 6 hours to obtain a glass-epoxy laminate with a thickness of 1.6 mm.

[0192] The laminates were tested for flame retardancy, dielectric constant and molding properties. The results are listed in Table 2.

[0193]The epoxy resin varnish obtained i...

Embodiment 2~24

[0196] A laminate was prepared in the same manner as in Example 1, except that the flame-retardant epoxy resin composition whose formulation was shown in Tables 2-5 was used. They were tested for flame retardancy, dielectric constant, moldability and solder heat resistance. The results are listed in Tables 2-5.

Embodiment 25

[0200] 15.95% by mass of phenol biphenyl aralkyl resin (phenolic resin 1), 12.57% by mass of bisphenol A type epoxy resin (epoxy resin 4), 15.0% by mass of aluminum hydroxide, 55.0% by mass of fused pulverized silica powder, 1.40% by mass of a silane coupling agent, 0.20% by mass of carnauba wax, and 0.24% by mass of triphenylphosphine (T.P.P.). The premix was kneaded on a heated roll at 100°C for about 5 minutes. The kneaded material was cooled and ground to obtain a resin composition.

[0201] The resin composition shown in Example 25 was compressed into tablets. The tablet was preheated to 85°C and molded with a single plunger die casting machine in accordance with the requirements of the UL 94 flame retardancy specification, provided that injection time: 15 seconds, injection pressure: 100kg / cm 2 (working pressure), molding temperature: 175°C, molding time: 120 seconds. The molding material was post-cured at 175° C. for 6 hours to obtain a molded plate for flame retarda...

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Abstract

A flame-retardant epoxy resin composition comprising an epoxy resin, a hardener, and a metal hydroxide, wherein either the hardener is a phenolic resin (C) comprising structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A) in the molecular chain or the epoxy resin is a novolak epoxy resin (D) which is the phenolic resin (C) in which the phenolic hydroxyl groups have been etherified with glycidyl. The composition has a high degree of flame retardancy.

Description

technical field [0001] The present invention relates to a flame-retardant epoxy resin composition with good flame retardancy and safety, and a varnish solution, and prepregs and laminates all prepared from the composition. Background technique [0002] In an epoxy resin composition requiring flame retardancy for fire prevention, a halogen-based flame retardant is generally used, and antimony trioxide is used as a flame retardant aid. [0003] The use of such flame retardants and flame retardant aids in epoxy resin compositions poses safety concerns and can lead to metal corrosion. For these reasons, such epoxy resin compositions are problematic in application. For example, when such an epoxy resin composition is used as an insulating material for electric parts, in some cases, the corrosion resistance of wires especially at high temperatures decreases, with the result that the reliability of the electric parts is impaired. Therefore, there is a need to develop an epoxy res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/04B32B15/08B32B15/092C08G59/06C08G59/62C08J5/24C08K3/22C08L63/00H01L23/14
CPCC08K3/22C08G59/063C08L63/00C08G59/621Y10T428/31663Y10T428/31515Y10T428/31511C08L61/04C08L2666/16
Inventor 木内幸浩位地正年
Owner NEC CORP