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A display panel, a display device, and a method for manufacturing a display panel

A technology for a display panel and a manufacturing method, which are used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, instruments, etc.

Active Publication Date: 2019-12-03
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a display panel, a display device, and a method for manufacturing a display panel, so as to solve the problem existing in the prior art of how to obtain a display product with a narrow lower frame under the condition of omitting the pad bending process

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  • A display panel, a display device, and a method for manufacturing a display panel
  • A display panel, a display device, and a method for manufacturing a display panel
  • A display panel, a display device, and a method for manufacturing a display panel

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Embodiment Construction

[0033] A display panel, a display device, and a method for manufacturing a display panel provided by embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] The thickness, shape and size of each film layer in the drawings do not reflect the true proportion of the display panel, but are only intended to schematically illustrate the content of the present invention.

[0035] A display panel provided by an embodiment of the present invention, such as Figure 2a and Figure 2b As shown, it includes: a display substrate 201, a chip on film (Chip On Film, COF) 202 disposed at the side frame of the display surface away from the display substrate 201, and an insulating glue filled between the display substrate 201 and the chip on film 202. 203, and an integrated circuit chip 204 fixed on the side of the chip-on-chip 202 away from the display substrate 201; wherein,

[0036] The chip-on-chip film 202 is fixed on the...

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Abstract

The invention discloses a display panel, a display device and a manufacturing method of the display panel. After a chip-on-chip film is attached to a frame on a side of the display surface away from a display substrate by using an insulating adhesive, and then the insulating adhesive is passed through the display substrate and the insulating adhesive respectively. And the conductive material in the multiple connection holes of the chip-on-chip film to realize the connection between the signal line at the display surface frame of the display substrate and the connection terminal arranged on the side of the chip-on-chip film away from the display substrate, so it not only saves the need to bend the Pad. The folding process is adopted, and there is no Pad bending area at the frame of the display panel, so that the lower frame of the display panel can be made narrower.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a display device and a method for manufacturing the display panel. Background technique [0002] With the continuous advancement of display technology, display panels are more and more widely used in display products. Display products with narrow bezels (Narrow Bezel) have attracted a large number of consumers because they can enable users to obtain a better viewing experience. [0003] Currently, Pad Bending is the only solution to realize a display product with a narrow lower bezel. However, there are many problems with the yield rate of the display products made by the Pad bending process, for example, as figure 1 As shown, cracks occur in the inorganic insulating layer in the Pad bending region P, which will lead to display failure. In the prior art, a mask (Mask) process is added to remove the inorganic insulating layer in the Pad bending area P;...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/32H01L24/83H01L2224/32225H01L2224/8302H10K59/80H10K59/8722H01L23/488H01L27/12G02F1/1345H10K59/131H10K50/86H10K71/00H10K59/1201
Inventor 高永益董向丹朴进山高文宝杨国波邱海军董婉俐王本莲
Owner BOE TECH GRP CO LTD