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Manufacturing method for high-frequency multilayer circuit board

A technology of multilayer circuit boards and manufacturing methods, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve problems such as delamination of explosion boards, and achieve increased usability, improved delamination of explosion boards, and better wiring design. elastic effect

Active Publication Date: 2018-11-13
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] An object of the present invention is to provide a method for manufacturing a high-frequency multilayer circuit board to solve the problem that traditional high-frequency multilayer circuit boards are prone to delamination

Method used

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  • Manufacturing method for high-frequency multilayer circuit board
  • Manufacturing method for high-frequency multilayer circuit board
  • Manufacturing method for high-frequency multilayer circuit board

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Embodiment Construction

[0020] In order to make the object, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0021] As used in the present specification and appended claims, the article "a" may generally be construed to mean "one or more" unless specified otherwise or clear from the context in the singular.

[0022] The invention provides a method for manufacturing a high-frequency multilayer circuit board, which improves the lamination structure at the interface that is prone to explosion and delamination, so that the multilayer circuit board structure will not be generated after thermal stress during the multi-press process Explosion board delamination problem can improve the traditional high-frequency multi-layer circuit board prone to explosion delamination problem, and also make the wiring design more flexible.

[0023] figure 2 A schematic ...

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Abstract

The invention provides a manufacturing method for a high-frequency multilayer circuit board. A first circuit substrate on a first pressure side closest to a second pressure side and a second circuit substrate on the second pressure side closest to the first pressure side are made of a same substrate material, so that binding force of interfaces which form complex regions when heat stress is applied on the interfaces after thermocompression is good, and a multi-layer circuit board structure does not easily generate blasting layering, so that a problem that a conventional high-frequency multilayer circuit board easily generate blasting layering is prevented.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a high-frequency multilayer circuit board. Background technique [0002] In order to improve the signal quality, each circuit substrate in the high-frequency multi-layer circuit board (high-frequency multi-layer circuitboard) reduces the dielectric constant (Dielectric Constant, Dk) and dissipation factor (Dissipation Factor, Df), and also reduces thermal expansion. Coefficient of Thermal Expansion (CTE), which is often achieved by adding more fillers or other additives to the material. Although the electrical properties and thermal stress are improved, it also makes the bonding force of the film on the circuit board worse, and some When the material is used in the multi-pressing process, it is easy to delaminate in the dense hole area at the junction of the secondary hot pressing after being subjected to thermal stress. Such as figure 1 A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/166
Inventor 吴克兴林峻毅叶东昌
Owner CHUNGHWA PRECISION TEST TECH