Power module, manufacturing method thereof, and air conditioner
A technology of power module and manufacturing method, which is applied in the manufacturing of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of poor manufacturing, the inability of thermosetting plastics to restore fluidity, and the inability to repair the manufacturing process.
Active Publication Date: 2020-10-20
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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Problems solved by technology
[0003] A power module generally has a power component and an encapsulation shell for encapsulating the power component. The encapsulation shell can be made of thermoplastic material or thermosetting material, and the thermosetting plastic encapsulant cannot recover its fluidity after molding.
However, after the power module is packaged, there may be packaging air holes on the outer wall surface of the package housing of the power module
The air holes in the package cannot be repaired due to the irreversible production process of the thermosetting plastic package, resulting in poor production, which leads to an increase in the scrap rate of the power module
Method used
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[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0042] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
[0043] In addition, if there are descriptions involving "first", "second" and ...
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The invention discloses a power module and a production method thereof and an air conditioner. The power module comprises a power component and a thermosetting package shell, wherein the power component is arranged in the thermosetting package shell; materials of the thermosetting package shell include a thermosetting molding compound and a thermosetting filler; and a softening point of the thermosetting molding compound is smaller than that of the thermosetting filler. According to the power module and the production method thereof and the air conditioner, the problem that air holes appearingin the package shell cannot be repaired and the package shell is poor in production to cause rise of the scrap rate of the power module due to the fact that a production process of thermosetting plastic package is irreversible is solved. The production yield of the power module is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a power module, a manufacturing method thereof, and an air conditioner. Background technique [0002] The power module, or IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology, and is generally used on electric control boards that drive fans, compressors and other equipment. [0003] A power module generally has a power component and an encapsulation case for encapsulating the power component. The encapsulation case can be made of thermoplastic material or thermosetting material, and the thermosetting plastic encapsulant cannot recover fluidity after molding. However, after the power module is packaged, there may be packaging air holes on the outer wall surface of the packaging case of the power module. The air holes in the package cannot be repaired due to the irreversible production process of the the...
Claims
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IPC IPC(8): H01L23/29H01L23/373H01L25/16H01L21/56
CPCH01L21/56H01L23/295H01L23/3737H01L25/16H01L2224/48091H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00014
Inventor 毕晓猛苏宇泉冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD