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Packaging fixture

A technology of fixtures and packaging films, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low production efficiency and achieve the effect of improving production efficiency

Active Publication Date: 2021-01-22
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above technical problems, the present invention provides a packaging jig to solve the problem of low production efficiency of single panel packaging

Method used

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Examples

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Embodiment Construction

[0019] The features and principles of the present invention will be described in detail below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, not to limit the protection scope of the present invention.

[0020] like figure 1 As shown, this embodiment provides a packaging fixture, including a packaging body 1, the first surface of the packaging body 1 is provided with a plurality of grooves 11 corresponding to the number of components to be packaged, and the grooves 11 are used to accommodate The packaging film used to package the components to be packaged.

[0021] The arrangement of multiple grooves 11 can realize simultaneous packaging of multiple components to be packaged, and the number of grooves 11 corresponds to the number of components to be packaged, which improves production efficiency. figure 1 The number of middle grooves 11 is 6, but it is not limited thereto.

[0022] The positions and shapes...

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Abstract

The invention relates to a packaging jig, comprising a packaging body, a first surface of the packaging body is provided with a plurality of grooves corresponding to the number of components to be packaged, and the grooves are used to accommodate packaging for packaging the components to be packaged Membrane. The beneficial effect of the present invention is: to realize simultaneous packaging of multiple parts to be packaged, and to improve production efficiency.

Description

technical field [0001] The invention relates to the technical field of liquid crystal product production, in particular to a packaging jig. Background technique [0002] Organic Light-Emitting Device (OLED) is a new type of lighting and display technology with unique advantages. The packaging process of large-size OLED panels generally adopts metal packaging, which reduces cost and thickness. , The improvement of heat dissipation performance has a great advantage. But metal is different from glass, metal is not easy to cut, and the whole metal film is directly attached to multiple panels that need to be packaged, which will make it impossible to cut in subsequent manufacturing. Therefore, at present, the metal package is mostly packaged separately by the panel, and the production efficiency is low. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the present invention provides a packaging jig, which solves the problem of low pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCH10K50/84
Inventor 赵利豪田彪潘天峰张建辉金韬吴解书崔勇
Owner BOE TECH GRP CO LTD