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LED module glue-filling method and LED module with display surface subjected to glue filling

A technology of LED modules and display surfaces, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as damage and LED device drop, and achieve the effect of enhancing anti-collision

Active Publication Date: 2018-12-14
UNILUMIN GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then when the LED device is bumped, it is easy to cause the LED device to drop or be damaged.

Method used

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  • LED module glue-filling method and LED module with display surface subjected to glue filling
  • LED module glue-filling method and LED module with display surface subjected to glue filling
  • LED module glue-filling method and LED module with display surface subjected to glue filling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] This embodiment proposes a glue filling method for LED modules.

[0045] Please see figure 1 and figure 2 , the LED module glue filling method includes:

[0046] In step S101 , the dam membrane 200 is arranged around the LED module 100 , and the dam membrane 200 and the display surface of the LED module 100 form a storage pool (not marked). Among them, the dam diaphragm 200 is preferably made of hard material, and is preferably made of transparent material. And it is better to use non-stick material.

[0047] Step S102, filling the holding tank with filling glue (not marked). Among them, the filling glue has fluidity and can be filled to every position of the holding pool when it is filled. It is better to use non-foaming glue for filling glue. Filling glue can be mixed and defoamed by vacuum mixer.

[0048] Step S103 , covering the opening of the storage pool with the surface forming film 300 . Wherein, the front and back of the surface forming film 300 may ha...

Embodiment 2

[0059] This embodiment proposes a glue filling method for LED modules, and additional steps are added on the basis of the above embodiments. details as follows:

[0060] Please see image 3 , the LED module glue filling method also includes:

[0061] Step S202 , controlling the height of the upper edge of the dam diaphragm 200 to be consistent with the surface of the LED lamp of the LED module 100 .

[0062] Step S203 , controlling the lower edge of the dam diaphragm 200 to protrude downward from the soldering of the LED module 100 by at least three millimeters.

[0063] Other steps in this embodiment are the same as those in the above-mentioned embodiment, for details, please refer to the above-mentioned embodiment, and details are not repeated here.

[0064] Among them, the control scheme can be to adjust the height of the dam diaphragm in advance. When it is installed in place, the upper end of the dam diaphragm 200 has been consistent with the surface height of the LED;...

Embodiment 3

[0067] This embodiment proposes a glue filling method for LED modules, and additional steps are added on the basis of the above embodiments. details as follows:

[0068] Please see Figure 4 , the LED module glue filling method also includes:

[0069] Step S304, placing the LED module 100 on the bracket 500, so that the back of the LED module 100 is suspended and the display surface is horizontal.

[0070] Wherein, the bracket 500 may be a single thick column bracket, or multiple thin column brackets.

[0071] Other steps in this embodiment are the same as those in the above-mentioned embodiment, for details, please refer to the above-mentioned embodiment, and details are not repeated here.

[0072] In the LED module glue filling method provided in this embodiment, the back of the LED module 100 is suspended in the air through a bracket, so that the back of the LED module 100 can be prevented from being stained with filling glue. When the LED module 100 is supported horizo...

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Abstract

The invention discloses an LED module glue-filling method and an LED module with a display surface subjected to glue filling. The LED module glue-filling method comprises the following steps: a box dam diaphragm is arranged around the LED module, and the box dam diaphragm and the display surface of the LED module form an accommodation pool; the accommodation pool is with filled with filling glue;a surface forming film is utilized to cover a mouth of the accommodation pool; then a shaping flat plate pressed to the mouth of the accommodation pool; and when waiting for preset curing time in preset environment, the shaping flat plate, the surface forming film and the box dam diaphragm are removed to obtain the LED module with the display surface subjected to glue filling. The LED module glue-filling method provided by the invention has the effect of improving the anticollision performance of the LED module.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a glue filling method for an LED module and an LED module for glue filling a display surface. Background technique [0002] With the development of LED technology, the pitch of LED pixels is getting smaller and smaller, and the size of LED devices used in it is also getting smaller and smaller. Then, when the LED device is bumped, it is easy to cause the LED device to drop or be damaged. Contents of the invention [0003] The main purpose of the present invention is to provide a method for pouring glue into an LED module and an LED module with glue pouring on a display surface, aiming at improving the anti-collision performance of the LED module. [0004] In order to achieve the above object, the LED module glue filling method proposed by the present invention, the LED module glue filling method includes: [0005] A dam diaphragm is arranged around the LED module, and the da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/483H01L33/52H01L2933/0033H01L2933/005
Inventor 张世诚袁贤阳赵平林
Owner UNILUMIN GRP
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