A kind of encapsulation mold and encapsulation method thereof

Abstract

The invention relates to an encapsulating mold and an encapsulating method thereof. The method comprises the following steps that firstly, chip installing and routing are carried out on the front faceof a base plate; secondly, the base plate is placed on a lower mold set, an upper mold set is provided with a plurality of stretchable protruding blocks, the upper mold set and the lower mold set areassembled, a piston is extruded during encapsulating to generate pressure, plastic package glue passes through a runner opening from the piston to enter the interior of a mold cavity, the stretchableprotruding blocks are adjusted through the air pressure to control the speed of mold flow around single products, filling is continuously carried out after the mold flow speed is stabilized, and after the mold sets are filled with the plastic package glue, the piston keeps static for a certain period of time until the plastic package glue hardens; thirdly, the stretchable protruding blocks on theupper mold set start to shrink, the upper mold set is opened, and encapsulating products are taken out; and fourthly, the plastic package glue left around the encapsulating products is removed, and cutting is carried out to form the single products. By means of the encapsulating mold and the encapsulating method thereof, the problem about product air bubbles generated by back packaging of the plastic package glue on the upper surface of a product unit is solved in the plastic package process of products using the traditional encapsulating technology.

Description

technical field [0001] The invention relates to an encapsulation mold and an encapsulation method thereof, belonging to the technical field of semiconductor encapsulation. Background technique [0002] Basic production method of traditional encapsulation process: [0003] In the existing encapsulation process, the encapsulation mold device includes: the upper module and the lower module are equipped with piston ports, the piston is placed in the middle of the substrates of the upper and lower modules, chips are arranged on the substrates, and a pair of flow channels are arranged on both sides of each piston port The base plate is connected, and the runner port is connected with the upper mold on the base plate. When the piston is squeezed to generate pressure, the plastic compound will enter the mold cavity from the piston through the runner port. After the plastic compound fills the module, the piston remains still for a period of time until the plastic body hardens. Then...

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide an encapsulation mold and its encapsulation method for the above-mentioned prior art, which can solve the problem that the upper surface of the product unit is backpacked due to the plastic encapsulation colloid during the plastic encapsulation process of the product using the traditional encapsulation process. Resulting product bubble problem

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