A precise film-pasting chip-mounting machine

Abstract

The invention discloses a precise film-pasting chip-mounting machine, which comprises a machine table and a steel ring feeding mechanism, a wafer feeding mechanism, white film raw material shaft, white film waste receiving shaft, white film feed tensioning assembly, a pressing fit cutter assembly and a steel ring receiving mechanism arranged on the machine table, the steel ring feeding mechanism and the wafer feeding mechanism are respectively arranged at the front end of the machine table and located on the same horizontal line, the pressing fit cutter assembly is arranged in the middle position of the machine table and is vertically arranged with the steel ring feeding mechanism and the wafer feeding mechanism, and the white film feeding tensioning assembly is arranged below the press-fit cutter assembly and between the white film raw material shaft and the white film waste receiving shaft. As that method is adopted, the invention fully realizes the automation of stick film and sticking label, the whole structure is compact, the integration level is high, the production efficiency is high, the sticking film is firm, there is no obvious bubble between the film and the steel ring,the production process is intelligent and data-based, the production is fully automatic, and the operation is simple.

Description

technical field [0001] The invention relates to the field of placement machines, in particular to a precision film placement machine. Background technique [0002] At present, the film-attaching methods of the placement machine mainly include manual film-attachment or pick-and-place machine for film-attachment, but the placement machines in the prior art are all semi-automatic placement machines, the operation is relatively complicated, and there is still the problem of cumbersome manual work. At the same time, when attaching the film to the wafer, the film is not firm, and there are obvious air bubbles between the bonding surfaces, resulting in the problem of unsatisfactory fixing effect between the bonding surfaces, low work quality, and a great impact on production efficiency. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a precision film mounter, which fully realizes the automation of film patch labeling, ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a precision film mounter, which fully realizes the automation of film patch labeling, adds demand modules that cannot be met by semi-automatic mounters, and greatly simplifies the previous tedious process of manual work. The overall structure It is compact and highly integrated. It adopts double-up wafers and double-down clamps. The operation of the equipment will not be affected when the wafers are loaded and the clamps are unloaded. The production efficiency is high, the film is firm, and there is no obvious air bubble between the film and the steel ring. , the production process is intelligent and digital, fully automatic production, easy to operate

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