Automatic film and chip mounter

Abstract

The present invention discloses an automatic film and chip mounter. The automatic film and chip mounter comprises a machine bench, a cam divider module, a wafer feed mechanism, a steel ring feed mechanism, a pressing film mounting cutting module, a labeling module, a finished product unloading mechanism, a white film raw material shaft, a water film waste material receiving shaft and a steel ringmaterial recovering mechanism. The cam divider module is arranged at the middle portion of the machine bench, the steel ring feed mechanism, the pressing film mounting cutting module, the labeling module and the finished product unloading mechanism are arranged on the cam divider module, the white film raw material shaft and the water film waste material receiving shaft are respectively located attwo sides of the upper end of the pressing film mounting cutting module, and the pressing film mounting cutting module is arranged on the machine bench and located at one side of the finished productunloading mechanism. According to the mode, the automatic film and chip mounter comprehensively achieves automatic film, chip and label mounting, is compact in whole structure, high in integrated level, high in production efficiency and firm in film mounting, there is no obvious bubble between films and steel rings, the production process is intelligent and digitized, automatic production is performed, and operation is simple.

Description

technical field [0001] The invention relates to the field of placement machines, in particular to an automatic film placement machine. Background technique [0002] At present, the film-attaching methods of the placement machine mainly include manual film-attachment or pick-and-place machine for film-attachment, but the placement machines in the prior art are all semi-automatic placement machines, the operation is relatively complicated, and there is still the problem of cumbersome manual work. At the same time, when attaching the film to the wafer, the film is not firm, and there are obvious air bubbles between the bonding surfaces, resulting in the problem of unsatisfactory fixing effect between the bonding surfaces, low work quality, and a great impact on production efficiency. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a fully automatic film placement machine, which fully realizes the automation of film...

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a fully automatic film placement machine, which fully realizes the automation of film placement and labeling, increases the demand modules that cannot be met by semi-automatic placement machines, and greatly simplifies the cumbersome process of manual work before. The structure is compact, the integration is high, the operation of the equipment is not affected when the wafer is loaded and the clip is unloaded, the production efficiency is high, the film is firm, and there is no obvious air bubble between the film and the steel ring, the production process is intelligent and digital, fully automatic production, simple operation

Images