Micro LED array device, mass transfer device and related method
An array and device technology, which is applied in the field of mass transfer devices and Micro LED array devices, can solve the problems of poor light utilization and light consumption, and achieve the effects of improving efficiency, simplifying transfer methods, and avoiding manufacturing and removal processes
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2019-01-15
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Abstract
Description
technical field
[0001] The present invention relates to the technical field of manufacturing semiconductor devices, in particular to a Micro LED array device, a mass transfer device and related methods. Background technique
[0002] The LED (Light Emitting Diode, Light Emitting Diode) backlight display technology has been widely used in various industries. Existing LEDs are mainly used on medium and large size display screens. Taking a 55-inch 4K TV as an example, the pixel length and width are about 200 μm, and the mainstream specification of direct-lit backlight is 3030 (3mm×3mm).
[0003] At present, the pixel pitch of most light-emitting diode displays is more than 100 microns. As a backlight source, the size is much larger than the pixel size and cannot be used as a point light source. High-quality full-color effects can only be achieved by using surface light sources with liquid crystals and color filters. But the liquid crystal display will consume most of the ligh...
Examples
Embodiment Construction
[0053]As mentioned in the background technology section, one of the difficulties in the development of Micro LED technology currently lies in the mass transfer process of Micro LED.
[0054] The inventors found that, in the prior art, methods such as bonding are provided for mass transfer, but the bonding method requires the setting of an adhesive layer and subsequent removal, which makes the process of mass transfer less efficient. Or in the prior art, a magnetic layer is added to the external structure of the light-emitting diode, and the structure is adsorbed by magnetic force. However, since an adhesive layer is required to adhere multiple Micro LED array devices together, the adhesion needs to be removed later. The attached layer and the additional magnetic layer make the operation complicated and many steps in the mass transfer process of Micro LED array devices.
[0055] Based on this, the present invention provides a Micro LED array device, including:
[0056] A Micro...