A mounting mechanism for a mounting machine
A placement machine and head-mounting technology, which is applied in the direction of bendable/stretchable parts of the circuit, printed circuit parts, electrical components, etc., can solve the problem of unfavorable placement efficiency, uncontrollable placement rate, improvement, etc. problems, to achieve the effect of improving placement efficiency and improving placement yield
Pending Publication Date: 2019-01-18
GUANGDONG UCAN ROBOT TECH CO LTD
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Problems solved by technology
[0003] In the prior art, the reinforcing sheet is mainly pasted on the substrate by glue. In the process of patching, the reinforcing sheet needs to be placed on the substrate first, and then the reinforcing sheet and the substrate are dried by the operator's hand-held oven. The curing glue between them is complicated to operate, which is not conducive to the improvement of placement efficiency; in addition, manual baking by operators mainly depends on the experience of operators to determine whether to dry, which will also lead to uncontrollable placement yield
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[0029] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention.
[0030] see Figure 1 to Figure 4 As shown, a bonding mechanism for a placement machine of the present invention includes a head assembly 1, and the head assembly 1 includes a bottom plate 2, a slide plate 3 slidably arranged on the bottom plate 2, arranged on the bottom plate 2 and used to drive The first driving member 4 that the slide plate 3 slides back and forth, the support plate 5 that is slidably arranged on the slide plate 3, the buffer spring 6 for driving the support plate 5 to reset, the second drive member 7 that is arranged on the support plate 5, and the second The suction head 8 connected to the output end of the driver 7, the heating element 9 arranged on the suction...
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The invention relates to the technical field of mounting machines, in particular to a mounting mechanism for a mounting machine, which includes a mounting header assembly, A mounting header assembly includes a base plate, a slide plate slidingly arranged on the bottom plate, a first driving member arranged on the bottom plate and for driving the slide plate to slide back and forth, a support plateslidably arranged on that slide plate, a cushion spring for driving the support plate to reset, a second driving member arranged on the support plate, a suction head connected with the output end ofthe second driving member, and a heating member arranged on the suction head; a sliding direction of the slide plate is arranged parallel to the sliding direction of the support plate, a second driving member is used for driving the suction head to rotate, and a suction hole penetrates the suction head; In actual use, the suction head is heated by a heating element, and after the suction head is heated to the required temperature, the reinforcement sheet is sucked by the suction head, and then the reinforcement sheet is adhered on the substrate, and the heat of the suction head is transferredto the substrate through the reinforcement sheet, so as to ensure that the reinforcement sheet and the substrate are quickly solidified and connected together, and thus the mounting efficiency and thepatch yield are improved.
Description
technical field [0001] The invention relates to the technical field of chip mounters, and in particular discloses a bonding mechanism for chip mounters. Background technique [0002] With the progress and development of society and the rapid development of electronic products, the demand for flexible circuit boards is also increasing. With the development trend of thinner and lighter flexible circuit boards, the strength of flexible circuit boards is getting lower and lower. In order to meet the needs of the strength of the flexible circuit board, it is necessary to paste a reinforcing sheet on the flexible circuit board. [0003] In the prior art, the reinforcing sheet is mainly pasted on the substrate by glue. In the process of patching, the reinforcing sheet needs to be placed on the substrate first, and then the reinforcing sheet and the substrate are dried by the operator's hand-held oven. The curing glue between them is complicated to operate, which is not conducive t...
Claims
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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0281H05K3/00
Inventor 王俊锋彭子阳周志宇
Owner GUANGDONG UCAN ROBOT TECH CO LTD