3D (three-dimensional) glass with interlayer circuit and preparation method and application thereof

A glass and 3D technology, which is applied in the field of 3D glass with interlayer circuits and its preparation, can solve problems such as the difficulty of bonding antennas or coils to 3D glass, and achieve changeable industrial design, wide design freedom, and reduced process effect of difficulty

Pending Publication Date: 2019-03-08
厦门祐尼三的新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the defect of difficulty in bonding antennas or coils to 3D glass in the prior art, and propose a new type of 3D glass internal circuit structure, preparation method and application

Method used

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  • 3D (three-dimensional) glass with interlayer circuit and preparation method and application thereof
  • 3D (three-dimensional) glass with interlayer circuit and preparation method and application thereof
  • 3D (three-dimensional) glass with interlayer circuit and preparation method and application thereof

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0029] The present invention solves the defects of difficulty in bonding antennas or coils to 3D glass, low yield, and high cost in the prior art, and proposes a process of welding conductive functional layers such as antennas or coils with two kinds of glass to obtain a new type of 3D glass. Circuit structure in glass, preparation method and application. Specifically, the embodiment of the present invention discloses a 3D glass with an interlayer circuit and its preparation method and application.

[0030] Please combine the following Figure 1-3 , the embodiment of the present invention first provides a 3D glass 10 with an interlayer circuit, which includes a first glass 11, a second glass 12, and a conductive functional layer 13 disposed therebetween, and the conductive functional layer can be formed on the first glass or one side of the second gla...

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Abstract

The invention discloses a 3D (three-dimensional) glass with an interlayer circuit and a preparation method and application thereof. The 3D glass comprises a first glass, a second glass, and a conductive functional layer arranged therebetween, and the conductive functional layer is formed on one side, which faces the second glass, of the first glass; and the first glass with the conductive functional layer and the second glass are combined by fusion bonding to form the 3D glass, so that the conductive functional layer and the 3D glass form an inseparable integrated structure. According to the 3D glass with the interlayer circuit disclosed by the invention, the requirement on various communication antenna and wireless charge functions of the 3D glass can be met, the industrial shape design of the 3D glass can be more diversified, the difficulty of processes is decreased, and the degree of freedom of design is increased.

Description

technical field [0001] The invention relates to the technical field of 3D glass, in particular to a 3D glass with an interlayer circuit and a preparation method and application thereof. Background technique [0002] With the improvement of people's demand for the appearance and function of mobile phones, and the maturity of technology, more and more products are devoted to the front cover and back cover of mobile phones using 3D glass, and the design of mobile phones combined with glass materials is also more diversified. . In line with the development of 5G communication smartphones, since the metal back cover or metal middle frame limits the 5G communication signal, glass or other non-conductive back covers must be used, and the 5G antenna is glued to the back cover. Also, the same goes for wireless charging coils. [0003] A solution to the above problems is proposed in the prior art: the film material with antenna function is bonded to 3D glass, the above film material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C27/12C03C17/00C03B23/02
CPCC03B23/023C03C17/001C03C27/10
Inventor 李裕文林奉铭赖彬
Owner 厦门祐尼三的新材料科技有限公司
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