Conductor paste for stainless steel thick-film circuit and preparation method of conductor paste

A technology of conductor paste and thick film circuit, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Good compatibility and low square resistance

Inactive Publication Date: 2019-03-12
浙江亮能机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thick film integrated circuits are simple in process, low in cost, and capable of high power, but there are certain restrictions on the types of components and numerical ranges they make.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A kind of preparation method for the conductor paste of stainless steel thick film circuit, this preparation method comprises the steps:

[0026] A, preparation of glass-ceramic powder: the SiO of 10KG 2 , 5KG Ba0, 8KG AI 2 o 3 , 25KG of CaO and 5KG of H 3 BO 3Pour it into a mixer and mix it. After mixing evenly, pour it into a high-temperature electric furnace for melting. The melting temperature is 1100°C, and the holding time is 2 hours. Then, it is crushed by a planetary ball mill to obtain glass slag, and then the glass slag is Put it into a ball mill to grind, and prepare glass-ceramic powder after grinding.

[0027] B. Modulation of platinum-palladium composite material: select platinum powder and palladium powder with particle size less than 1 μm, pour 2KG of platinum powder and 98KG of palladium powder into a power mixer and mix to obtain platinum-palladium composite material.

[0028] C. Preparation of organic solvent: 3KG of tributyl citrate, 0.2KG of th...

Embodiment 2

[0033] A kind of preparation method for the conductor paste of stainless steel thick film circuit, this preparation method comprises the steps:

[0034] A, preparation of glass-ceramic powder: the SiO of 40KG 2 , 30KG Ba0, 50KG AI 2 o 3 , 70KG of CaO and 25KG of H 3 BO 3 Pour it into a mixer and mix it. After mixing evenly, pour it into a high-temperature electric furnace for melting. The melting temperature is 1500°C, and the holding time is 4 hours. Then, it is crushed by a planetary ball mill to obtain glass slag, and then the glass slag is Put it into a ball mill to grind, and prepare glass-ceramic powder after grinding.

[0035] B. Modulation of platinum-palladium composite material: select platinum powder and palladium powder with particle size less than 1 μm, pour 20KG of platinum powder and 80KG of palladium powder into a power mixer and mix to obtain platinum-palladium composite material.

[0036] C, prepare organic solvent: put 30KG tributyl citrate, 10KG thixot...

Embodiment 3

[0041] A kind of preparation method for the conductor paste of stainless steel thick film circuit, this preparation method comprises the steps:

[0042] A, preparation of glass-ceramic powder: the SiO of 25KG 2 , 10KG Ba0, 20KG AI 2 o 3 , 50KG of CaO and 15KG of H 3 BO 3 Pour it into a mixer and mix it evenly. After mixing evenly, pour it into a high-temperature electric furnace for melting. The melting temperature is 1300°C, and the holding time is 3 hours. Then, it is crushed by a planetary ball mill to obtain glass slag, and then the glass slag is Put it into a ball mill to grind, and prepare glass-ceramic powder after grinding.

[0043] B. Modulation of platinum-palladium composite material: select platinum powder and palladium powder with particle size less than 1 μm, pour 11KG of platinum powder and 90KG of palladium powder into a power mixer and mix to obtain platinum-palladium composite material.

[0044] C, prepare organic solvent: put 20KG tributyl citrate, 5KG ...

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PUM

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Abstract

The invention discloses a conductor paste for a stainless steel thick-film circuit and a preparation method of the conductor paste. The conductor paste comprises 70-90wt% of solid-phase powder and 30-10wt% of organic solvent, wherein the solid-phase powder comprises 99.5-95wt% of platinum-palladium composite material and 0.5-5wt% of microcrystal glass powder. The method comprises the following steps of A, preparing microcrystal glass powder; B, preparing the platinum-palladium composite material; C, preparing the organic solvent; D, preparing the solid-phase powder; and E, preparing the conductor paste. The conductor paste has the advantages of low square resistance coefficient, favorable welding performance, favorable printing characteristic and sintering characteristic, favorable matching performance with stainless steel substrate and favorable conductivity.

Description

technical field [0001] The invention relates to a conductor paste and a preparation method thereof, in particular to a conductor paste for stainless steel thick film circuits and a preparation method thereof. Background technique [0002] Thick film circuit refers to an integrated circuit composed of a passive network fabricated by array film technology and assembled with discrete semiconductor devices, monolithic integrated circuits or micro components on the same substrate. It is generally considered that a film with a thickness of several microns to tens of microns is a thick film, and the materials for making a thick film are five types of pastes: conductor, resistor, dielectric, insulation, and encapsulation. Thick-film integrated circuits are simple in process, low in cost, and capable of high power, but there are certain restrictions on the types and numerical ranges of components it makes. Integrated circuits are divided into thick film circuits, thin film circuits ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00C03C10/00
Inventor朱峙谢江西
Owner浙江亮能机电科技有限公司