Semiconductor wafer cleaning equipment

Abstract

An embodiment of the present disclosure provides semiconductor wafer cleaning equipment. The semiconductor wafer cleaning equipment includes a rotating base with a through hole. The semiconductor wafer cleaning apparatus further includes a shaft extending through the through hole. The semiconductor wafer cleaning equipment also includes a clamping piece. The clamping piece covers the through hole and is connected to the rotating shaft. The rotating shaft communicates with a gap in the through hole. The gap is formed between the rotating base and the clamping piece. In addition, the semiconductor wafer cleaning device includes a sealing ring adjacent to the gap and located farther from the rotating shaft than the gap.

Description

technical field [0001] The embodiment of the present invention relates to a semiconductor wafer cleaning device, in particular to a semiconductor wafer cleaning device with a clamping mechanism and a sealing structure. Background technique [0002] The semiconductor integrated circuit (IC) industry has grown exponentially, and technological advancements in integrated circuit materials and design have produced multiple eras of integrated circuits, and each era has smaller and more complex circuits than the previous era. During the development of integrated circuits, functional density (ie, the number of interconnects per chip area) typically increases as geometry size (ie, the smallest component or circuit that can be produced in a process) shrinks. . This downscaling process increases production efficiency and reduces associated costs. This shrinking process also increases the complexity of manufacturing and producing integrated circuits. [0003] One or more wafers are u...

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Problems solved by technology

[0004] Although existing manufacturing machines are generally sufficient to meet their needs, they are still not fully satisfied

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