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Bamboo inner joint removal device

A kind of equipment, bamboo technology, applied in the direction of mechanical equipment, sugarcane machining, etc., can solve the problem that the inner section of bamboo cannot be placed stably

Active Publication Date: 2019-03-29
扬州市杭集创意设计园有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a device for removing the inner section of bamboo to solve the technical problem in the prior art that the inner section of bamboo cannot be placed smoothly when it is removed

Method used

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Embodiment Construction

[0036] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0037] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0038] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] In the description of the present invention, it should be noted that the...

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Abstract

The invention discloses a bamboo inner joint removal device, and belongs to the technical field of bamboo processing. The bamboo inner joint removal device comprises a feeding device, a bamboo joint polishing device and an inner joint removal device, wherein the feeding device is positioned beside the bamboo joint polishing device, the inner joint removal device is located at the front end of thebamboo joint polishing device and is in contact connection with the bamboo joint polishing device, the bamboo joint polishing device comprises a conveying assembly, a positioning assembly and a polishing assembly, the conveying assembly is positioned at the front end of the feeding device, the polishing assembly is arranged on the positioning assembly and extends into the positioning assembly, theinner joint removal device comprises a joint breaking assembly, an arrangement assembly and a grinding assembly, one end of the joint breaking assembly is in contact fit with the positioning assembly, the other end of the joint breaking assembly is in contact fit with the arrangement assembly, and the polishing assembly is arranged on the side wall of the arrangement assembly. According to the device, bamboo is driven by a rotating wheel arranged on a workbench to rotate, a grinding block is used for grinding the bamboo joint through a coated abrasive paper, so that the bamboo joint is the same as the bamboo in diameter.

Description

technical field [0001] The invention relates to the technical field of bamboo processing, in particular to a device for removing internal knots of bamboo. Background technique [0002] my country is a relatively leading country in bamboo processing and utilization, but in terms of production scale, most of them are small and medium-sized enterprises, and in terms of production technology and equipment, it is still in the form of a combination of mechanical equipment and manual operations. In order to obtain the whole bamboo without cracks to unfold the bamboo flat, the inner joint removal of the bamboo tube is a key step. The efficiency of the inner joint removal step affects the bamboo unfolding processing progress and processing cost, and the inner joint removal effect also directly affects the unfolding quality of the bamboo flat. As far as the existing processing equipment is concerned, it still cannot meet the needs of completely adopting mechanical debonding, that is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27J1/00
CPCB27J1/00
Inventor 高月民段建英王小玲
Owner 扬州市杭集创意设计园有限公司
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