How the chip is made

Abstract

Provided is a chip manufacturing method capable of dividing a plate-shaped workpiece to manufacture a plurality of chips without using an expanding sheet. The manufacturing method of this chip includes the following steps: In the first laser processing step, only The laser beam is irradiated on the chip area to form the first modified layer along the planned division line of the chip area; the second laser processing step is to position the laser beam with a wavelength that is transparent to the workpiece at the first modified layer. irradiating the laser beam along the planned division line at 2 depth positions to form a second modified layer whose end portion overlaps with the remaining peripheral region; and a division step of applying force to the workpiece to divide the workpiece into individual chips, In the dividing step, the workpiece is divided into individual chips by imparting force by heating and cooling.

Description

Technical field [0001] The present invention relates to a method of manufacturing a chip, a plate-shaped workpiece manufactured by dividing a plurality of chips. Background technique [0002] In order for the wafer will be shaped to be representative of a workpiece (a workpiece) into a plurality of chips, there is known a method: laser beam having converging inner permeable workpiece is formed by multiphoton absorption being upgraded modified layer (modified region) (e.g., refer to Patent Document 1). Modified layer brittle than other regions, and therefore by applying a force to the workpiece after forming the modified layer is formed along division lines (streets), so that the modified layer can be a starting point for the workpiece to be divided into a plurality of chips . [0003] When the workpiece is formed on the modified layer, applying a force, for example using the extended piece (extended band) is attached to the workpiece having stretch and expand a method (e.g., refe...

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned method of expanding the expansion chip, the used expansion chip cannot be reused, so the cost required for chip manufacturing is also likely to increase.

In particular, a high-performance expansion sheet that does not easily remain on the chip as an adhesive material is also expensive, so when such an expansion sheet is used, the cost required to manufacture the chip also increases.

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