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Processing apparatus

A processing device and processing unit technology, which is applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve problems such as complicated operations, and achieve the effect of improving operation efficiency

Pending Publication Date: 2018-12-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the unloading unit and the transfer unit constituting the cluster module system, it is necessary to change the wafer holding pad every time the type of wafer to be processed is changed, and there is a problem that the work is complicated

Method used

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Experimental program
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Embodiment Construction

[0020] Hereinafter, the processing apparatus of this embodiment will be described with reference to the drawings. figure 1 with figure 2 The processing device 10 shown in the overall structure is a cluster module system configured by arbitrarily combining units of various functions, and can process a variety of wafers in a simultaneous manner. figure 1 Shows a state in which each unit constituting the processing device 10 is disassembled, figure 2 The processing device 10 in a state where the units are combined is shown.

[0021] The processing apparatus 10 includes a cassette placement unit 11, an unloading unit 12, a transfer unit 13, a wafer holding pad storage unit 14, a centering unit 15, a plurality of processing units 16 a, 16 b, 16 c, a cleaning unit 17, and a control unit 18.

[0022] The cassette placement unit 11 has a plurality of cassette placement tables 20a, 20b, 20c, and 20d arranged in a row, and cassettes 21a, 21b, 21c, and 21a, 21b, 21c, and 21c, which are placed...

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Abstract

Provided is a processing apparatus. Accordingly, wafer holding pads for all kinds of wafers are easily selected. In the processing apparatus, a delivery unit for delivering a wafer includes a first wafer holding pad detachably coupled to the tip end of a mobile unit, for holding the wafer, and an unloading unit for unloading and loading a wafer includes a second wafer holding pad detachably coupled to the tip end of a mobile unit, for holding the wafer. The processing apparatus also includes a wafer holding pad storage unit for storing a plurality of first and second wafer holding pads available in a plurality of types matching different kinds of wafers. Before the wafer is unloaded from a cassette, the delivery unit and the unloading unit are equipped respectively with the first wafer holding pad and the second wafer holding pad that correspond to the wafer.

Description

Technical field [0001] The invention relates to a processing device for processing wafers. Background technique [0002] In the manufacturing process of semiconductor devices or electronic components, a semiconductor wafer or a plate-shaped workpiece composed of various materials such as a ceramic substrate is thinned by a grinding device or a polishing device to form a predetermined thickness, and then mounted The cutting tool on the spindle of the laser processing device or the cutting device is divided into individual device chips. In recent years, with the diversification of processing methods (thinning, etc.) of workpieces, a wafer processing apparatus (cluster module system) in which various processing apparatuses can be freely combined and cooperated has been proposed (see Patent Document 1). In such a cluster module system, a variety of device wafers can be processed in a simultaneous manner. [0003] Patent Document 1: Japanese Patent Application Publication No. 2015-819...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/673H01L21/677
CPCH01L21/67155H01L21/6735H01L21/67739H01L21/67742H01L21/67769H01L21/67294H01L21/67766H01L21/68707H01L21/67778
Inventor 关家一马
Owner DISCO CORP