Laser marking partition bonding device and method thereof

Abstract

The invention relates to a laser marking partitioning joint device and method. The laser marking partitioning joint device comprises a laser marking device, a laser source device and a visual device,the laser marking device drives a laser source device, and the laser marking device comprises: a user interface for drawing graphics and import request data; an arithmetic module for outputting readable data according to graphics and request data; a galvanometer module for driving the laser source device; and a controller module for receiving readable data and data transmitted by the galvanometermodule, and carrying out interpolation on the readable data and the data transmitted by the galvanometer module to obtain the default value of connection graph parameters; the laser source device receives the default value of the connection graph parameters and marks the carrying out partition marking on a workpiece; and the visual device has an image capturing module and an image comparison module. The image capturing module captures the partition marking image on the workpiece, and the image comparison module carries comparison and returns the image discrimination result to the user interface. The partition marking is used to correct the partition marking image, and the visual device determines whether the partition marking image is good or bad.

Description

technical field [0001] The invention relates to a laser marking subarea joining device and a method thereof, in particular to a laser marking subarea joining device for laser marking by using an image subarea joining method. Background technique [0002] At present, the laser marking machine forms marks such as characters and patterns on the surface of the workpiece by laser. Compared with the traditional mechanical engraving or chemical etching, it has the advantages of high precision, high speed and permanent marking. Therefore, in the industry, especially in the integrated circuit industry, IC marking with high precision and mass production is required, so the laser marking technology and device are very important in the industry. [0003] A general laser marking machine includes a laser source, a control card and a galvanometer module. The laser source emits laser light. In order to match the characteristics of fast speed and high precision marking, the laser in the lase...

AI Technical Summary

Problems solved by technology

The overlapping part 99C of the laser source track will be laser marked twice, so that the unclear place in the original marking process can be marked twice to make it clearer, and finally the actual marking pattern 99 is formed. The method uses the overlapping part of the laser source track to join the partition graphics to make the marking clear, but the overlapping part 99C of the laser source track is easy to be misaligned, so it is easy to connect the wrong map and mark in the overlapping part 99C of the laser source track Error, and there is no start and end point for processing acceleration and deceleration, it is easy to occur in the overlapping part of the laser source trajectory 99C figure 1 The match head figure represented by the actual marking pattern 92 in

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