High-frequency test bench for QFN chip

Abstract

The invention provides a high-frequency test bench for a QFN chip. The high-frequency test bench comprises at least two layers of mutually overlapped test main boards, and a guiding pressing plate arranged on the test main boards; a holding through hole cavity for holding the QFC chip is formed in the middle of the guiding pressing plate; the middles of the test main boards are detection parts, and each detection part is located below the holding through cavity; detection hole slots are formed on the detection parts, and probes connected with the QFN chips are arranged in the detection hole slots, and the probes are arranged in a sheet shape; the detection hole slots on the upper layer test main body and the lower lowery test main board are staggered, and two ends of each probe are locatedin the detection hole slots are different layers; the contact points at the bottom of the QFN chip are in contact connection with the test main boards through the probes. The test bench provided by the invention has the advantages that the test bench has a transmission capacity of a high-frequency signal, the high-frequency connection between the QFN chip and a circuit board is guarantee under the condition of guaranteeing the bearing of relative large current.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a high-frequency test seat. Background technique [0002] With the rapid development of chip technology, the existing high-frequency test socket is a spring probe type test socket, which has a long signal transmission channel, and the inductive reactance and capacitive reactance of the probe itself are relatively high, which is not good for the transmission quality of high-frequency signals. high. With the increase of the signal transmission frequency in the current chip, the traditional socket structure based on the spring probe test has encountered severe challenges, and it is necessary to develop a new structure of test probes and corresponding test sockets to meet the development needs. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the present invention provides a high-frequency test socket. [0004] The ...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of chip technology, the existing high-frequency test socket is a spring probe type test socket, which has a long signal transmission channel, and the inductive reactance and capacitive reactance of the probe itself are relatively high, which is not good for the transmission quality of high-frequency signals. high

With the increase of the signal transmission frequency in the current chip, the traditional socket structure based on the spring probe test has encountered severe challenges, and it is necessary to develop a new structure of test probes and corresponding test sockets to meet the development needs.

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