Structured light projector and method and application thereof

Abstract

The invention discloses a structured light projector and its method and application. The structured light projector is provided to be installed in a housing of a structured light device. The structured light projector includes a projection module, a fixing bracket and a heat conduction element. The fixing bracket is suitable for being installed on the housing, and the projection module is fixedly connected with the fixing bracket. The heat conduction element is arranged between the projection module and the fixing bracket, so as to transmit the heat of the projection module to the housing of the structured light device.

Description

technical field [0001] The present invention relates to a technical field of structured light, and more particularly relates to a structured light projector and its method and application. Background technique [0002] In recent years, with the great progress and rapid development of structured light technology, the application of structured light equipment is becoming more and more popular. Structured Light technology (Structured Light) is an active optical measurement technology. Its basic principle is to project a controllable light spot, light strip or light surface structure on the surface of a measured object (or measured target) by a projection module. (that is, light with a special structure, referred to as structured light), and an image is obtained by a receiving module (such as an image sensor), through the geometric relationship of the system, the three-dimensional coordinates of the measured object are calculated by using the triangulation principle, and then th...

AI Technical Summary

Problems solved by technology

Although this heat dissipation method can solve the heat dissipation problem to a certain extent, it will bring new and more difficult problems

[0007] First of all, the semiconductor cooling chip needs to rely on electric energy to transfer heat for cooling. Usually, the semiconductor cooling chip is electrically connected to the main board, and then the semiconductor cooling chip is powered through the motherboard, so that the semiconductor cooling chip can work normally to cool and dissipate heat. However, this will inevitably increase the power consumption of the mainboard, and instead increase the heat generated by the structured light device, that is, this heat dissipation method increases the heat dissipation burden of the structured light device itself, and thus The original intention of solving the heat dissipation problem runs counter to

[0008] Secondly, since the peltier is an independent electronic component, when assembling the structured light device, it is necessary to consider not only how to fix the peltier to the projection module, but also the connection between the motherboard and the peltier. Electrically connected circuit layout, which will undoubtedly greatly increase the difficulty of assembling the structured light device

More importantly, it is difficult to ensure sufficient contact between the peltier and the projection module without leaving a gap, so that the effective heat exchange area between the peltier and the projection module is reduced, thereby reducing the The heat exchange efficiency between the projection module and the semiconductor cooling sheet affects the heat dissipation efficiency of the structured light device

[0009] Finally, due to the complex structure of the semiconductor cooling chip itself, the production cost is relatively high, and an independent circuit needs to be configured to control the operation of the semiconductor cooling chip, so the manufacturing cost and the use cost of the structured light device will be correspondingly increased, thus It is not conducive to the promotion and popularization of the structured light equipment

Images