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Rotatable electrostatic chuck having backside gas supply

An electrostatic chuck and air hole technology, applied in circuits, discharge tubes, electrical components, etc., can solve problems such as destroying vacuum seals and affecting output

Active Publication Date: 2019-07-23
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, yield is negatively impacted (because of breaking the vacuum seal when switching between high-temperature and low-temperature electrostatic chucks)

Method used

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  • Rotatable electrostatic chuck having backside gas supply
  • Rotatable electrostatic chuck having backside gas supply
  • Rotatable electrostatic chuck having backside gas supply

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Embodiments of a substrate support pedestal and a rotatable and heated electrostatic chuck incorporating the substrate support pedestal are provided herein. The substrate support base of the present invention advantageously improves the uniformity of backside gas distribution. The substrate support pedestal of the present invention also increases throughput when switching between high temperature and low temperature processes by providing a removable pedestal that can be quickly compared to processes that are suitable for operation at different temperatures another base swap. The electrostatic chuck of the present invention advantageously allows DC power to be coupled from a DC power source to one or more chucking electrodes disposed in the rotating base.

[0019] figure 1 is a schematic cross-sectional view of a plasma processing chamber according to some embodiments of the present disclosure. In some embodiments, the plasma processing chamber is a physical vapor de...

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PUM

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Abstract

Embodiments of a substrate support pedestal and an electrostatic chuck incorporating same are disclosed herein. In some embodiments, a substrate support pedestal includes: a body having an upper surface and a lower surface opposite the upper surface; one or more chucking electrodes disposed within the body; a plurality of substrate support elements protruding from the upper surface to support a substrate; a hole disposed in the lower surface at a center of and partially through the body; a plurality of gas holes disposed in the upper surface proximate the center of the body, wherein the plurality of gas holes is disposed above and fluidly coupled to the hole; and a plurality of gas distribution grooves formed in the upper surface and fluidly coupled to the plurality of gas holes.

Description

technical field [0001] Embodiments of the present disclosure generally relate to electrostatic chucks for holding substrates in microelectronic device fabrication processes. Background technique [0002] Forming some devices on a substrate (eg, STT-RAM) requires multilayer thin films deposited in a deposition chamber, such as a physical vapor deposition (PVD) chamber. In some embodiments, during the deposition process, the substrate needs to be rotated to obtain good film uniformity. For example, when a deposition process requires multiple cathodes and targets to deposit different materials, since each target is typically positioned off-axis relative to the substrate, the substrate needs to be rotated to ensure good film uniformity. Deposition of certain layers may also require heating of the substrate. Furthermore, the deposition process requires high vacuum pressures. Electrostatic chucks are often used to electrostatically hold a substrate on a substrate support during...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/67109H01L21/67115H01L21/6831H01L21/68742H01L21/68792H01L21/6875H01L21/6833H01J37/32715H01L21/67017H01L21/67098
Inventor 比哈瑞斯·斯瓦米纳森伟·王
Owner APPLIED MATERIALS INC