Method for making metal-based circuit board by laser cutting method
A metal-based circuit board, laser cutting technology, applied in the field of circuit board manufacturing, can solve the problem of inability to achieve independent insulation of copper bosses, and achieve the effect of satisfying heat dissipation and high heat dissipation
Active Publication Date: 2021-11-05
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0003] It can be seen that the existing boss plate has the problem that the copper boss and the copper base are integrated, that is, all the copper bosses are connected to each other, and the independent insulation of the copper bosses cannot be achieved.
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[0049] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components. Apparently, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0050] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or col...
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Abstract
The embodiment of the invention discloses a method for manufacturing a metal-based circuit board by a laser cutting method, and relates to the technical field of circuit board manufacturing. This technical solution takes metal-based circuit boards as the research object (including: metal-based single-sided boards, metal-based single-sided multilayer boards), and the copper substrates are laser cut and vacuum silk screen resin is used to fill the cutting gaps to create mutually insulated areas. Then make a copper boss on this area, and after the copper boss is browned, press it with the window RCC to form a copper-based single-sided board, and then make a circuit board according to the normal process. After the design is electroplated, the copper bosses are reconnected and conducted, and the electroplated copper needs to be etched away when the outer layer is etched, so that the copper bosses are independently insulated, and finally realize the micro-pitch, high heat dissipation, and multi-network design.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing metal-based circuit boards by laser cutting. Background technique [0002] Metal-based printed circuit boards are often used in high-power, high-heat dissipation products because of their good heat dissipation capabilities (the thermal conductivity of metal copper is 400W / m.k). Generally, there are two designs for high heat dissipation metal substrates: 1. Copper boss, the height of the copper boss is consistent with the line surface, the components are mounted on the copper boss to dissipate heat, and all copper bosses are connected to each other; The concave cup is lower than the dielectric layer, and the position of the concave cup is silk-screened with solder paste, and the components are mounted on the position of the concave cup, and the solder paste is connected to the concave cup to dissipate heat, and all the concave cups ar...
Claims
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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0044H05K3/0047H05K3/06H05K2203/107
Inventor 刘玮王远罗奇张飞龙
Owner KINWONG ELECTRONICS TECH LONGCHUAN