A sealed chassis with multi-module independent cooling air ducts

Abstract

The invention relates to a sealed cabinet with an independent cooling air duct for each module. The bearing skeleton of the cabinet is formed by a left side plate, a right side plate, a front frame, a rear frame and a middle separation plate; the independent air duct cavity is welded with the left side plate and a right side plate for pre-processing wedge-shaped locker universal slots needed for mounting of each standard plug-in through welding flange positioning end surfaces at two ends of the independent air duct cavity; and the independent air duct cavity is internally provided with inner fins needed by cooling of module plug-ins. An array piezoelectric plane fan assembly is arranged on the left side plate and fan blades are located inside the independent air duct cavity, and a corresponding relationship is formed with the inner fins in a one-dimensional array mode. A left packaging plate and a right packaging plate are arranged on the left side plate and the right side plate, the left packaging plate and the right packaging plate are provided with a plurality of array holes, and effects of protecting the fan blades and both considering ventilation and filtration are realized.

Description

technical field [0001] The invention belongs to the two fields of machinery and circuits, and in particular relates to a sealed case with multi-module independent cooling air ducts. Background technique [0002] Multiple general-purpose CPCI / VPX plug-ins or power modules often transmit signals through the motherboard, which is located at the bottom of the printed board and perpendicular to the printed board plug-in. The printed board plug-in is composed of a printed board, a locker and a cold plate. After the connector at the end of the printed board is mated with the connector on the motherboard, it is fixed on the vertical beam on the inner wall of the chassis by the friction of the locker. . There are heat dissipation fins brazed in the two side walls of the traditional ATR case, and a fan is installed at the rear of the case. The heat from the chip on the printed board is transferred to the cold plate through the insulating flexible heat conduction pad, and then the hea...

AI Technical Summary

Problems solved by technology

This method of internal and external circulation heat exchange can carry out efficient heat exchange of the ATR chassis, but the bottleneck of its heat dissipation is: if the core heat exchanger adopts the current traditional form of internal and external double fins, the heat exchange efficiency is low, and sometimes in order to increase The wind pressure of the internal and external circulation requires a large wind pressure and flow for the fan to generate the convection of the internal and external circulation, which directly leads to excessive fan power and excessive noise

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