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Heat dissipating fin assembly

a technology of heat dissipation fins and components, which is applied in the direction of machines/engines, liquid fuel engines, lighting and heating apparatus, etc., can solve the problems affecting the reliability of products, and achieve the effects of reducing and increasing the density of heat dissipation structures

Inactive Publication Date: 2015-12-31
DELTA ELECTRONICS INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a heat dissipating fin assembly with improved heat dissipating efficiency. The assembly has a lower density of heat dissipating structure at the inner end to prevent dust accumulation, and a higher density of heat dissipating structure at the outer end to maintain a larger heat dissipating surface area. The assembly also includes an inner cover plate and an outer cover plate with an opening to exhaust dusts and improve heat dissipating efficiency. In another embodiment, the assembly has a lower density of heat dissipating structure at the inner end and a higher density of heat dissipating structure at the outer end. The assembly can prevent dust accumulation and maintain a larger heat dissipating surface area.

Problems solved by technology

However, these features make the internal temperature of the electronic products become higher and higher, which may cause the product unstable and thus affect the reliability of the products.

Method used

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Embodiment Construction

[0051]The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.

[0052]FIG. 1 is a schematic diagram showing an assembled heat dissipating device la according to an embodiment of the invention, FIG. 2 is an exploded view of the heat dissipating device 1a of FIG. 1, and FIG. 3 is a schematic diagram showing a part of the assembled heat dissipating device 1a of FIG. 1. Referring to FIGS. 1 and 2, the heat dissipating device 1a of this embodiment includes a fan F, a heat dissipating fin assembly 14 and a block 15. The fan F includes a fan frame 11, an impeller 12 and a motor 13. The motor 13 is disposed in the fan frame 11. The impeller is mounted on the motor 13, so that the motor 13 is connected to the impeller 12 and drives it to rotate. The fan frame 11 has an inlet 111 and an outlet 112. The heat dissipating fin assembly 14 is disposed at the pos...

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PUM

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Abstract

A heat dissipating fin assembly includes a bottom plate, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover plate and an outer cover plate. The first heat dissipating fins extend from an inner end to an outer end. The second heat dissipating fins are located between two of the first heat dissipating fins. The inner cover plate is disposed at the inner end and connected to the first heat dissipating fins. The outer cover plate is disposed at the outer end and connected to the second heat dissipating fins. The outer cover plate and the inner cover plate are separated so as to form an opening. The second heat dissipating fins extend from around the opening to the outer end. The length of the first heat dissipating fins is larger than that of the second heat dissipating fins.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 103122426 filed in Taiwan, Republic of China on Jun. 27, 2014, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of Invention[0003]The present invention relates to a heat dissipating fin assembly and, in particular, to a heat dissipating fin assembly with dusting function.[0004]2. Related Art[0005]The electronic products are developed with higher performance, higher frequency, higher speed, and lighter and thinner structure. However, these features make the internal temperature of the electronic products become higher and higher, which may cause the product unstable and thus affect the reliability of the products. Therefore, the existing electronic products are usually equipped with a fan to dissipate the generated heat.[0006]Regarding to a common heat-dissipating fan, the outlet o...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F3/02
CPCF28F3/02F28F2250/08F28F19/00F28F2215/04F04D17/16F04D29/5826
Inventor YANG, SHU-CHENGCHANG, CHIH-HSIANGCHEN, SHIH-CHOU
Owner DELTA ELECTRONICS INC
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